Datasheet > BAT54_10

BAT54_10

更新时间： 2024-11-01 08:48:51

品牌	Logo	应用领域
美台 - DIODES		肖特基二极管
页数	文件大小	规格书
4页	89K
描述
SURFACE MOUNT SCHOTTKY BARRIER DIODE

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BAT54_10 数据手册

BAT54 /A /C /S

SURFACE MOUNT SCHOTTKY BARRIER DIODE

Features

Mechanical Data

•

Low Turn-on Voltage

Fast Switching

PN Junction Guard Ring for Transient and ESD Protection

Lead Free/RoHS Compliant (Note 3)

“Green” Molding Compound (No Br, Sb) (Note 4)

Qualified to AEC-Q101 Standards for High Reliability

•

Case: SOT-23

Case Material: Molded Plastic, “Green” Molding Compound.

UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020

Terminals: Matte Tin Finish annealed over Alloy 42 leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

Polarity: See Diagrams Below

Marking Information: See Page 3

Ordering Information: See Page 2

Weight: 0.008 grams (approximate)

•

Top View

BAT54

BAT54A

BAT54C

BAT54S

Maximum Ratings @T_A= 25°C unless otherwise specified

Characteristic

Symbol

V_RRM

V_RWM

V_R

Value

Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

Forward Continuous Current (Note 2)

Repetitive Peak Forward Current

200

300

600

I_F

I_FRM

I_FSM

Forward Surge Current

@ t < 1.0s

Thermal Characteristics

Characteristic

Power Dissipation (Note 2)

Symbol

Value

200

Unit

°C/W

°C

P_D

Thermal Resistance, Junction to Ambient Air (Note 2)

Operating and Storage Temperature Range (Note 5)

500

R_θ

-65 to +150

T_J, T_STG

Electrical Characteristics @T_A= 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

Reverse Breakdown Voltage (Note 1)

V_(BR)R

⎯

I_RS= 100μA

I_F= 0.1mA

I_F= 1mA

I_F= 10mA

I_F= 30mA

240

320

400

500

800

Forward Voltage

⎯

V_F

I_F= 100mA

Reverse Leakage Current (Note 1)

Total Capacitance

2.0

I_R

⎯

μA

V_R= 25V

C_T

V_R= 1.0V, f = 1.0MHz

I_F= 10mA through I_R= 10mA to

I_R= 1.0mA, R_L= 100Ω

Reverse Recovery Time

5.0

t_rr

⎯

Notes:

1. Short duration test pulse used to minimize self-heating effect.

2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

3. No purposefully added lead.

4. Products manufactured with date code VD (Week 50, 2008) and newer are built with Green Molding Compound. Products manufactured with date code

prior to VD are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃Fire Retardants.

5. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dP_D/dT_J< 1/R_θJA

1 of 4

www.diodes.com

June 2010

BAT54 /A /C /S

Document number: DS11005 Rev. 25 - 2

12 3 4

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