Datasheet > BAT46WSHE3

BAT46WSHE3

更新时间： 2023-12-06 20:10:48

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
3页	453K
描述
Tape&Reel: 3Kpcs/Reel;

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中文翻译

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数据手册

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BAT46WSHE3 数据手册

BAT46WSHE3

Features

• Halogen Free. “Green” Device (Note 1)

• AEC-Q101 Qualified

• High Breakdown Voltage

• Low Turn-on Voltage

Schottky Barrier

• Guard Ring Construction For Transient Protection

• Epoxy Meets UL 94 V-0 Flammability Rating

• Moisture Sensitivity Level 1

• Polarity: Indicated By Cathode Band

• Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS

Compliant. See Ordering Information)

Diode

200mW

Maximum Ratings

• Operating Junction Temperature Range: -55°C to +125°C

• Storage Temperature Range: -55°C to +150°C

• Thermal Resistance(Note 2)：500°C /W Junction to Ambient

SOD-323

Maximum

Maximum DC

Blocking

MCC

Recurrent

Peak Reverse

Voltage

RMS Voltage

Part Number

Voltage

BAT46WSHE3

100V

71V

100V

Electrical Characteristics @ 25°C Unless Otherwise Specifie

Cathode Mark

Forward Continuous

Current

I_F

150mA

750mA

200mW

Non-repetitive Peak

Forward surge current

t = 8.3ms

I_FSM

P_D

Power Dissipation

DIMENSIONS

INCHES MM

DIM

NOTE

I_F=0.1mA;

I_F=10mA;

I_F=250mA;

0.25V(Max)

0.45V(Max)

1.0V(Max)

MIN MAX MIN MAX

0.090 0.107 2.30 2.70

0.063 0.071 1.60 1.80

0.045 0.053 1.15 1.35

0.031 0.045 0.80 1.15

0.010 0.016 0.25 0.40

0.004 0.018 0.10 0.45

0.004 0.010 0.10 0.25

----- 0.006 ----- 0.15

Forward Voltage

Drop(Note3)

V_F

V_R=1.5V

V_R=10V

V_R=50V

V_R=75V

0.3µA(Max)

0.5µA(Max)

1.0µA(Max)

2.0µA(Max)

Reverse Voltage

Leakage current

I_R

Reverse Breakdown

Voltage(Note 3)

V_(B

I_R=100μA

100V(Min)

Suggested Solder Pad Layout

V_R=0V, f=1.0MHz

V_R=1V, f=1.0MHz

20pF(Max)

12pF(Max)

Junction Capacitance

C_J

1.88mm

I_F=I_R=10mA,

Typical Reverse

Recovery Time

t_rr

2ns

Irr=0.1*I_R,R_L=100Ω

0.69mm

Note: 1. Halogen free "Green” products are defined as those which contain <900ppm bromine,

0.56mm

<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

Note: 2. Part mounted on FR-4 board with recommended pad layout.

Note: 3. Short duration pulse test used to minimize self-heating effect.

Rev.4-1-02082023

1/3

MCCSEMI.COM

12 3

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