SPICE MODEL: BAT40VC
BAT40VC
Lead-free Green
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS
Features
·
·
·
·
Low Forward Voltage Drop
A
Fast Switching
Ultra-Small Surface Mount Package
SOT-563
PN Junction Guard Ring for Transient and
ESD Protection
Dim Min
Max
0.30
1.25
1.70
0.50
1.10
1.70
0.60
0.30
0.18
Typ
0.25
1.20
1.60
B
C
A
B
C
D
G
H
K
L
0.15
1.10
1.55
·
·
Lead Free by Design/RoHS Compliant (Note 1)
"Green" Device (Note 4)
D
G
Mechanical Data
·
·
0.90
1.50
0.56
0.10
0.10
1.00
1.60
0.60
0.20
¾
Case: SOT-563
M
K
Case Material: Molded Plastic, "Green" Molding
Compound. UL Flammability Classification Rating 94V-0
H
·
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: See Diagram
L
M
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
C2
All Dimensions in mm
C1
NC
·
·
·
Ordering: See Page 2
Marking & Type Code Information: See last page
Weight: 0.003 grams (approximate)
A2
A1
NC
@ TA = 25°C unless otherwise specified
Maximum Ratings
Characteristic
Symbol
Value
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
40
V
IF
200
350
mA
mA
mA
°C
Forward Continuous Current (Note 2)
Repetitive Peak Forward Current (Note 2)
Forward Surge Current (Note 2)
IFRM
IFSM
750
@ tp =10ms
Tj, TSTG
Operating and Storage Temperature Range
-65 to +125
@ TA = 25°C unless otherwise specified
Electrical Characteristics
Characteristic
Symbol Min
Typ
Max
Unit
Test Condition
V(BR)R
40
Reverse Breakdown Voltage (Note 3)
IR = 100mA
IF = 2.0mA
IF = 15mA
IF = 100mA
IF = 200mA
¾
¾
V
330
420
mV
Forward Voltage (Note 3)
¾
¾
VF
800
1000
VR = 25V
IR
Reverse Leakage Current (Note 3)
Total Capacitance
¾
¾
¾
500
10
nA
pF
VR = 1.0V, f = 1.0MHz
CT
¾
IF = 10mA through IR = 10mA
to IR = 1.0mA, RL = 100W
trr
Reverse Recovery Time
¾
¾
5.0
ns
@ TA = 25°C unless otherwise specified
Thermal Characteristics
Characteristic
Power Dissipation (Note 2)
Symbol
Value
150
Unit
mW
Pd
RqJA
Thermal Resistance, Junction to Ambient Air (Note 3)
833
°C/W
Notes:
1. No purposefully added lead.
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Short duration test pulse used to minimize self-heating effect.
4. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php
DS30637 Rev. 3 - 2
1 of 2
BAT40VC
www.diodes.com
ã Diodes Incorporated