SPICE MODELS: BAS70W BAS70W-04 BAS70W-05 BAS70W-06
BAS70W/ -04/ -05/ -06
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Lead-free Green
Features
·
·
·
·
·
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Low Turn-on Voltage
Fast Switching
SOT-323
PN Junction Guard Ring for Transient and ESD Protection
Ultra-Small Surface Mount Package
Lead Free/RoHS Compliant (Note 3)
"Green" Device (Note 4 and 5)
Dim
A
Min
0.25
1.15
2.00
Max
0.40
1.35
2.20
A
B
C
B
C
Mechanical Data
D
0.65 Nominal
·
Case: SOT-323
E
G
H
0.30
1.20
1.80
0.0
0.40
1.40
2.20
0.10
1.00
0.40
0.18
8°
·
Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
G
H
K
J
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·
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Moisture Sensitivity: Level 1 per J-STD-020C
M
J
Terminals: Solderable per MIL-STD-202, Method 208
K
0.90
0.25
0.10
0°
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
L
D
E
L
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Polarity: See Diagrams Below
M
Marking: See Diagrams Below & Page 3
a
TOP VIEW
Weight: 0.006 grams (approximate)
All Dimensions in mm
BAS70W Marking: K73
BAS70W-05 Marking: K75
BAS70W-06 Marking: K76
@ TA = 25°C unless otherwise specified
BAS70W-04 Marking: K74
Maximum Ratings and Electrical Characteristics, Single Diode
Characteristic
Symbol
Value
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
70
V
VR(RMS)
IF
RMS Reverse Voltage
49
70
V
mA
mA
mW
°C/W
°C
Forward Continuous Current (Note 1)
Non-Repetitive Peak Forward Surge Current @ tp < 1.0s
Power Dissipation (Note 1)
IFSM
Pd
100
200
RqJA
Tj
Thermal Resistance Junction to Ambient Air (Note 1)
Operating Temperature Range
625
-55 to +125
-65 to +150
TSTG
Storage Temperature Range
°C
@ TA = 25°C unless otherwise specified
Electrical Ratings
Characteristic
Symbol
V(BR)R
Min
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 2)
IR = 10mA
70
—
—
tp <300µs, IF = 1.0mA
tp <300µs, IF = 15mA
410
1000
VF
Forward Voltage
—
mV
IR
tp < 300µs, VR = 50V
VR = 0V, f = 1.0MHz
Reverse Current (Note 2)
Total Capacitance
¾
¾
100
2.0
nA
pF
CT
IF = IR = 10mA to IR = 1.0mA,
Irr = 0.1 x IR, RL = 100W
trr
Reverse Recovery Time
—
5.0
ns
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30113 Rev. 11 - 2
1 of 3
BAS70W/ -04/ -05/ -06
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