BAS40L, SBAS40L
Schottky Barrier Diodes
These Schottky barrier diodes are designed for high speed switching
applications, circuit protection, and voltage clamping. Extremely low
forward voltage reduces conduction loss. Miniature surface mount
package is excellent for hand held and portable applications where
space is limited.
http://onsemi.com
Features
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
40 VOLTS
SCHOTTKY BARRIER DIODES
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
SOT−23 (TO−236)
CASE 318
Rating
Reverse Voltage
Symbol
Value
Unit
V
R
40
V
STYLE 8
Forward Power Dissipation
P
F
@ T = 25°C
225
1.8
mW
mW/°C
A
3
1
Derate above 25°C
CATHODE
ANODE
Operating Junction and Storage
Temperature Range
T
T
−55 to +150
°C
J, stg
MARKING DIAGRAM
Forward Continuous Current
I
120
mA
mA
F
Forward Surge Current
t v 1 s
t v 10 ms
I
FSM
200
600
B1 M G
G
Thermal Resistance (Note 1)
Junction−to−Ambient (Note 2)
R
508
311
°C/W
q
JA
B1 = Specific Device Code
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ minimum pad.
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may vary
depending upon manufacturing location.
2. FR−4 @ 1.0 x 1.0 in pad.
ORDERING INFORMATION
†
Device
Package
Shipping
BAS40LT1G,
SBAS40LT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
BAS40LT3G,
SBAS40LT3G
SOT−23
(Pb−Free)
10,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
November, 2012 − Rev. 10
BAS40LT1/D