BAS21WS-TP-HF

更新时间： 2024-10-01 13:05:51

品牌	Logo	应用领域
美微科 - MCC		信号二极管光电二极管
页数	文件大小	规格书
3页	169K
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中文翻译

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数据手册

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BAS21WS-TP-HF 数据手册

BAS19

THRU

BAS21

M C C

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

20736 Marilla Street Chatsworth

ꢆꢋꢅꢌꢍꢎꢍꢍ

ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

Micro Commercial Components

Features

ꢀ Ideally Suited for Automatic Insertion

ꢀ 150^oC Junction Temperature

ꢀ Fast Switching speed

Small

Signal Diodes

250mW

ꢀ Epitaxial Planar Die Construction

Mechanical Data

ꢀ Epoxy meets UL 94 V-0 flammability rating

ꢀ Moisture Sensitivity Level 1

SOT-23

Top View

ꢀ Weight: 0.008 grams ( approx.)

Repetitive

Peak

Reverse

Voltage

V_RRM(V)

Continuous

Reverse

Voltage

V_R(V)

MCC Part

Number

Marking

BAS19

BAS20

BAS21

100

150

200

120

200

250

DIMENSIONS

Maximum Ratings @ 25^oC Unless Otherwise Specified

INCHES

MIN

DIM

MAX

.120

.098

.055

.041

.081

.024

.0039

.044

.007

.020

MIN

2.80

2.10

1.20

.89

1.78

.45

.013

.89

MAX

NOTE

.110

.083

.047

.035

.070

.018

.0005

.035

.003

.015

3.04

2.64

1.40

1.03

2.05

.60

.100

1.12

.180

.51

Parameter Symbol Value Unit

Non-repetitive Peak

Forward Surge Current @ t=1s

Average Rectified Forward Current

Forward DC Current at T_amb=25^oC

Repetitive Peak Forward Current

Power Dissipation up to T_amb=25^oC

Thermal Resistance Junction to

Ambient

@ t=1us

2.5

0.5

I_FSM

(1)

I_F(AV)

I_F

200

.085

.37

(2)

200

625

250

Suggested Solder

Pad Layout

I_FRM

.031

.800

tot

^oC/W

^oC

.035

.900

430

.079

2.000

inches

T, T_STG

Operating & Storage Temperature

-65~150

Notes: (1) Measured under pulse conditions;

Pulse time = t_p<= 0.3ms

.037

.950

.037

.950

(2) Device on fiberglass substrate,

See layout on next page

www.mccsemi.com

Revision: A

2011/01/01

1 of 3

12 3

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