BAS19
THRU
BAS21
M C C
TM
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents
20736 Marilla Street Chatsworth
ꢆꢋꢅꢌꢍꢎꢍꢍ
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ
$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ
Micro Commercial Components
Features
ꢀ Ideally Suited for Automatic Insertion
ꢀ 150oC Junction Temperature
ꢀ Fast Switching speed
Small
Signal Diodes
250mW
ꢀ Epitaxial Planar Die Construction
Mechanical Data
ꢀ Epoxy meets UL 94 V-0 flammability rating
ꢀ Moisture Sensitivity Level 1
SOT-23
Top View
A
ꢀ Weight: 0.008 grams ( approx.)
D
3
Repetitive
Peak
Reverse
Voltage
VRRM (V)
Continuous
B
C
Reverse
Voltage
VR (V)
MCC Part
Number
1
2
Marking
F
E
BAS19
BAS20
BAS21
JP
JR
JS
100
150
200
120
200
250
H
G
J
K
DIMENSIONS
MM
Maximum Ratings @ 25oC Unless Otherwise Specified
INCHES
MIN
DIM
A
B
C
D
E
MAX
.120
.098
.055
.041
.081
.024
.0039
.044
.007
.020
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
MAX
NOTE
.110
.083
.047
.035
.070
.018
.0005
.035
.003
.015
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
Parameter Symbol Value Unit
Non-repetitive Peak
Forward Surge Current @ t=1s
Average Rectified Forward Current
Forward DC Current at Tamb=25oC
Repetitive Peak Forward Current
Power Dissipation up to Tamb=25oC
Thermal Resistance Junction to
Ambient
@ t=1us
2.5
0.5
IFSM
A
F
G
H
J
(1)
IF(AV)
IF
mA
mA
mA
mW
200
.085
.37
K
(2)
200
625
250
Suggested Solder
Pad Layout
IFRM
P
.031
.800
tot
oC/W
oC
R
.035
.900
430
JA
.079
2.000
inches
mm
T, TSTG
Operating & Storage Temperature
-65~150
j
Notes: (1) Measured under pulse conditions;
Pulse time = tp <= 0.3ms
.037
.950
.037
.950
(2) Device on fiberglass substrate,
See layout on next page
www.mccsemi.com
Revision: A
2011/01/01
1 of 3