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BAS16L

更新时间: 2024-11-19 14:53:11
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威世 - VISHAY /
页数 文件大小 规格书
5页 116K
描述
Small Signal Fast Switching Diode

BAS16L 技术参数

生命周期:Obsolete零件包装代码:SOT-23
包装说明:R-PDSO-G3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.03Is Samacsys:N
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODEJEDEC-95代码:TO-236AB
JESD-30 代码:R-PDSO-G3元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE认证状态:Not Qualified
表面贴装:YES端子形式:GULL WING
端子位置:DUALBase Number Matches:1

BAS16L 数据手册

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BAS16L  
Vishay Semiconductors  
www.vishay.com  
Small Signal Fast Switching Diode  
FEATURES  
Available  
• Silicon epitaxial planar diode  
• Fast switching diode  
• Leadless ultra small DFN1006-2A package  
(1 mm × 0.6 mm × 0.45 mm)  
1
2
• Power dissipation better than SOT-23  
• Surface-mounted device (SMD) plastic package  
with visible and sidewall plated / wettable flanks  
LINKS TO ADDITIONAL RESOURCES  
• Soldering can be checked by standard visual  
inspection. No X-ray inspection necessary to  
meet automotive AOI requirements  
3
D
3
D
3D Models  
Models  
Application  
Notes  
• AEC-Q101 qualified available  
MECHANICAL DATA  
Case: DFN1006-2A  
Weight: 0.83 mg  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
Molding compound flammability rating: UL 94 V-0  
Terminals: high temperature soldering guaranteed:  
Peak temperature max. 260 °C  
Packaging codes / options:  
08/10K per 7" reel (8 mm tape)  
PARTS TABLE  
PART  
ORDERING CODE  
AEC-Q101 QUALIFIED  
CIRCUIT CONFIGURATION  
TYPE MARKING  
REMARKS  
BAS16L-G3-08  
no  
D
.
BAS16L  
Single  
Tape and reel  
BAS16L-HG3-08  
yes  
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)  
PARAMETER  
Reverse voltage  
Forward current  
TEST CONDITION  
SYMBOL  
VALUE  
UNIT  
V
VR  
IF  
100  
250  
9
on FR-4 board with recommended soldering footprint  
mA  
tp = 1 μs  
tp = 1 ms  
Non repetitive forward current (1)  
IFSM  
1.7  
A
tp = 1 s  
0.5  
Repetitive peak forward current  
Power dissipation  
TL = 100 °C, tp = 1 ms, D = 0.05  
on FR-4 board with recommended soldering footprint  
IFRM  
Ptot  
500  
300  
1250  
mA  
mW  
mW  
RthJL = 100 K/W  
Note  
(1)  
Square wave, Tj = 25 °C prior to surge  
THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)  
PARAMETER  
TEST CONDITION  
SYMBOL  
VALUE  
UNIT  
Thermal resistance junction to  
ambient air  
according to JEDEC® 51-3 on FR-4 board with  
recommended soldering footprint  
RthJA  
420  
K/W  
Thermal resistance junction to lead  
Maximum junction temperature  
Storage temperature range  
RthJL  
Tj max.  
Tstg  
100  
150  
K/W  
°C  
-55 to +150  
-55 to +150  
°C  
°C  
Operating temperature range  
Top  
Rev. 1.2, 03-Dec-2021  
Document Number: 86187  
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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