BAS16HT1
Preferred Device
Switching Diode
MAXIMUM RATINGS
Rating
Symbol
Value
75
Unit
Vdc
http://onsemi.com
Continuous Reverse Voltage
Peak Forward Current
Peak Forward Surge Current
V
R
I
F
200
500
mAdc
mAdc
1
2
I
FM(surge)
CATHODE
ANODE
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
2
Total Device Dissipation FR-5 Board (Note 1)
P
D
200
mW
T = 25°C
A
Derate above 25°C
1.57
635
mW/°C
°C/W
°C
1
Thermal Resistance Junction to Ambient
Junction and Storage Temperature
R
θ
JA
SOD−323
CASE 477
STYLE 1
T , T
−55 to
150
J
stg
1. FR-4 Minimum Pad.
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
MARKING DIAGRAM
A
Characteristic
OFF CHARACTERISTICS
Reverse Voltage Leakage Current
Symbol
Min
Max
Unit
A6 M
I
R
µAdc
(V = 75 Vdc)
−
−
−
1.0
50
30
R
(V = 75 Vdc, T = 150°C)
A6 = Specific Device Code
R
J
(V = 25 Vdc, T = 150°C)
R
M
= Date Code
J
Reverse Breakdown Voltage
(I = 100 µAdc)
BR
V
75
−
Vdc
mV
(BR)
ORDERING INFORMATION
Forward Voltage
V
F
(I = 1.0 mAdc)
−
−
−
−
715
855
1000
1250
F
Device
BAS16HT1
Package
Shipping†
(I = 10 mAdc)
F
(I = 50 mAdc)
SOD−323 3000/Tape & Reel
F
(I = 150 mAdc)
F
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Diode Capacitance
(V = 0, f = 1.0 MHz)
R
C
−
−
−
−
2.0
1.75
6.0
45
pF
Vdc
ns
D
Forward Recovery Voltage
V
FR
(I = 10 mAdc, t = 20 ns)
F
r
Preferred devices are recommended choices for future use
and best overall value.
Reverse Recovery Time
(I = I = 10 mAdc, R = 50 Ω)
t
rr
F
R
L
Stored Charge
(I = 10 mAdc to V = 5.0 Vdc,
Q
pC
S
F
R
R = 500 Ω)
L
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
February, 2004 − Rev. 3
BAS16HT1/D