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BAS16HLP-7 PDF预览

BAS16HLP-7

更新时间: 2024-11-20 08:48:19
品牌 Logo 应用领域
美台 - DIODES 二极管开关
页数 文件大小 规格书
4页 89K
描述
SURFACE MOUNT FAST SWITCHING DIODE

BAS16HLP-7 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:DFN
包装说明:R-PBCC-N2针数:2
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.70风险等级:1.52
其他特性:HIGH RELIABILITY配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
最大正向电压 (VF):0.715 VJESD-30 代码:R-PBCC-N2
JESD-609代码:e4湿度敏感等级:1
最大非重复峰值正向电流:4 A元件数量:1
端子数量:2最高工作温度:150 °C
最低工作温度:-65 °C最大输出电流:0.215 A
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:CHIP CARRIER峰值回流温度(摄氏度):260
最大功率耗散:0.25 W认证状态:Not Qualified
最大重复峰值反向电压:100 V最大反向恢复时间:0.004 µs
子类别:Rectifier Diodes表面贴装:YES
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:NO LEAD
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
Base Number Matches:1

BAS16HLP-7 数据手册

 浏览型号BAS16HLP-7的Datasheet PDF文件第2页浏览型号BAS16HLP-7的Datasheet PDF文件第3页浏览型号BAS16HLP-7的Datasheet PDF文件第4页 
BAS16HLP  
SURFACE MOUNT FAST SWITCHING DIODE  
Please click here to visit our online spice models database.  
Features  
Mechanical Data  
Fast Switching Speed  
Case: DFN1006-2  
Case Material: Molded Plastic, "Green" Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020D  
Terminal Connections: Cathode Dot  
Terminals: Finish - NiPdAu over Copper leadframe.  
Solderable per MIL-STD-202, Method 208  
Marking Information: See Page 3  
Ordering Information: See Page 3  
Weight: 0.001 grams (approximate)  
Ultra-Small Surface Mount Package  
For General Purpose Switching Applications  
High Breakdown Voltage  
Lead Free by Design/RoHS Compliant (Note 1)  
"Green" Device (Note 2)  
Qualified to AEC-Q101 Standards for High Reliability  
DFN1006-2  
BOTTOM VIEW  
Maximum Ratings @T = 25°C unless otherwise specified  
A
Characteristic  
Non-Repetitive Peak Reverse Voltage  
Symbol  
VRM  
Value  
125  
Unit  
V
VRRM  
VRWM  
VR  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
100  
V
RMS Reverse Voltage  
Forward Continuous Current  
71  
215  
V
mA  
VR(RMS)  
IFM  
4
1
0.5  
Non-Repetitive Peak Forward Surge Current  
@ t = 1.0μs  
@ t = 1.0ms  
@ t = 1.0s  
A
IFSM  
Thermal Characteristics  
Characteristic  
Power Dissipation (Note 3)  
Symbol  
Value  
250  
Unit  
mW  
°C/W  
°C  
PD  
Thermal Resistance Junction to Ambient (Note 3)  
Operating and Storage Temperature Range  
500  
Rθ  
JA  
-65 to +150  
TJ , TSTG  
Electrical Characteristics @T = 25°C unless otherwise specified  
A
Characteristic  
Symbol  
Min  
Max  
Unit  
Test Conditions  
Reverse Breakdown Voltage (Note 4)  
100  
V
V(BR)R  
IR = 100μA  
IF = 1.0mA  
IF = 10mA  
IF = 50mA  
IF = 150mA  
0.715  
0.855  
1.0  
Forward Voltage  
V
VF  
1.25  
V
R = 80V  
VR = 80V, TJ = 150°C  
R = 25V, TJ = 150°C  
nA  
μA  
μA  
nA  
500  
50  
30  
Peak Reverse Current (Note 4)  
IR  
V
30  
VR = 25V  
Total Capacitance  
1.5  
4.0  
pF  
CT  
trr  
VR = 0V, f = 1.0MHz  
IF = IR = 10mA,  
Irr = 0.1 x IR, RL = 100Ω  
Reverse Recovery Time  
ns  
Notes:  
1. No purposefully added lead.  
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.  
3. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.  
4. Short duration pulse test used to minimize self-heating effect.  
1 of 4  
www.diodes.com  
May 2009  
© Diodes Incorporated  
BAS16HLP  
Document number: DS31740 Rev. 2 - 2  

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