BAS116
Taiwan Semiconductor
Small Signal Product
225mW, SMD Switching Diode
FEATURES
- Low power loss, high current capability, low VF
- Surface device type mounting
- Moisture sensitivity level 1
- Matte Tin (Sn) lead finish with
Nickel (Ni) under plate
- Pb free version and RoHS compliant
- Packing code with suffix "G" means
green compound (halogen-free)
SOT-23
MECHANICAL DATA
- Case: SOT- 23, molded plastic
- Terminal: Matte tin plated, lead free,
solderable per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed: 260°C/10s
- Weight: 8 mg (approximately)
- Marking Code: JV
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
PARAMETER
VALUE
SYMBOL
PD
UNIT
mW
V
Power Dissipation
225
Repetitive Peak Reverse Voltage
VRRM
IO
75
Mean Forward Current
200
mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0 s
Thermal Resistance (Junction to Ambient) (Note 1)
Junction and Storage Temperature Range
IFSM
500
mA
RθJA
330
°C/W
°C
TJ , TSTG
-55 to +150
PARAMETER
MIN
75
MAX
-
SYMBOL
UNIT
IR = 100 μA
IF = 1 mA
Reverse Breakdown Voltage
VBR
V
-
0.9
1.0
1.1
1.25
5
IF = 10 mA
IF = 50 mA
IF = 150 mA
-
VF
Forward Voltage
V
-
-
TJ=25°C
TJ=150°C
VR = 75 V
IR
Reverse Leakage Current
-
nA
80
VR = 0 V , f = 1.0 MHz
(Note 2)
Junction Capacitance
CJ
trr
-
-
2.0
3.0
pF
ns
Reverse Recovery Time
Notes : 1. Valid provided that electrodes are kept at ambient temperature
2. Reverse recovery test conditions : IF=10mA , IR=10mA , RL=100 Ω, IRR= 1mA
Document Number: DS_S1412037
Version: D15