BAS116
SURFACE MOUNT LOW LEAKAGE DIODE
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Features
Mechanical Data
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Surface Mount Package Ideally Suited for Automated Insertion
Very Low Leakage Current
Lead Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
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Case: SOT-23
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminal Connections: Solderable per MIL-STD-202, Method
208
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Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
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Polarity: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.008 grams (approximate)
SOT-23
TOP VIEW
Internal Schematic
TOP VIEW
Maximum Ratings @T = 25°C unless otherwise specified
A
Characteristic
Symbol
VRRM
VRWM
VR
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
85
V
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Repetitive Peak Forward Current
60
215
500
V
mA
mA
VR(RMS)
IFM
IFRM
4.0
1.0
0.5
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0ms
@ t = 1.0s
A
IFSM
Thermal Characteristics
Characteristic
Symbol
Value
250
Unit
mW
PD
Power Dissipation (Note 1) @T = 25°C
A
500
°C/W
°C
Thermal Resistance Junction to Ambient Air (Note 1) @T = 25°C
Operating and Storage Temperature Range
Rθ
JA
A
-65 to +150
TJ, TSTG
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 2)
85
V
V(BR)R
⎯
⎯
IR = 100μA
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
VR = 75V
0.90
1.0
1.1
Forward Voltage
V
VF
⎯
⎯
1.25
5.0
80
nA
nA
Leakage Current (Note 2)
Total Capacitance
IR
CT
trr
⎯
⎯
⎯
⎯
2
VR = 75V, Tj = 150°C
pF
⎯
VR = 0, f = 1.0MHz
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Reverse Recovery Time
3.0
⎯
μs
Notes:
1. Part mounted on FR-4 PC board with pad layout as shown on page 3.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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www.diodes.com
May 2008
© Diodes Incorporated
BAS116
Document number: DS30233 Rev. 9 - 2