B60/C60 Series
Heat Sink System
Ohmite introduces the powerful B60/
C60 series heatsink with cam clip (Pat.
Pending) or custom mounting. This
series offers flexible, high performance
and compact heat sink with exchange-
able cam clip system for TO-247 and
TO-264 devices. The built in lip is pro-
vided for mounting ease. The optional B
series can be tapped for popular Ohmite
resistors or other devices. These power-
ful heat sinks can be thru-hole soldered
as a single or dual unit. The dual unit
can be mated to a 60mm fan for greater
thermal performance. It is the ideal type
of heat sink for high power density and
small size (3U or 4U) electronic packag-
ing with forced convection.
SꢁꢀꢂꢁS SPꢁCꢂFꢂCatꢂONS
Heatsink
Surface Area
(in2 / mm2)
177 / 114,300 5.7 / 163
Weight Length L
consult factory for
alternate lengths and
clip combinations
Part Number
C60-075-VE
C60-075-AE
B60-075-VE
B60-075-AE
(oz / g)
(mm)
75
177 / 114,300 5.7 / 163
75
ChaꢀaCtꢁꢀꢂStꢂCS
Aluminum Alloy 6063-T5 or Equivalent with either degreased or black
anodized finish.
Heat Sink
Heat Dissipation
2
1.5
1
Music Wire, Per ASTM A228 with bright nickel plating
Spring Clip
Solder Foot
Cold-rolled Steel, Per ASTM A-366 with pure tin over copper strike.
RoHS compliant.
4 devices
60mm fan with 4 self-tapping M3.5 screws
Fan
For improvement, use thermal joint compound, 0.005 Grafoil (TGon
800 by Laird), or phase change material (Hi-Flow by Bergquist)
Insulator (Optional) Sil-Pad 900-S, K6 800-S and K10 by Bergquist
Interface Thermal
Resistance
2 devices
0.5
0
20
30
40
50
Fan Flow Rate (cfm)
(continued)
1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com
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