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B384T120T30

更新时间： 2024-11-06 06:39:55
品牌 Logo 应用领域
VICOR 转换器模拟IC信号电路输入元件
页数 文件大小 规格书
12页 1268K
描述
BCM Bus Converter

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中文翻译

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B384T120T30 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：DMA
包装说明：,Reach Compliance Code：compliant
HTS代码：8542.39.00.01风险等级：5.83
Is Samacsys：N其他特性：INPUT VOLTAGE RANGE IS 360V TO 400V
模拟集成电路 - 其他类型：ANALOG CIRCUITJESD-30 代码：R-XDMA-X
JESD-609代码：e4湿度敏感等级：5
功能数量：1最高工作温度：125 °C
最低工作温度：-40 °C封装主体材料：UNSPECIFIED
封装形状：RECTANGULAR封装形式：MICROELECTRONIC ASSEMBLY
峰值回流温度（摄氏度）：NOT SPECIFIED认证状态：Not Qualified
表面贴装：NO技术：HYBRID
温度等级：AUTOMOTIVE端子面层：NICKEL PALLADIUM GOLD
端子形式：UNSPECIFIED端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIEDBase Number Matches：1

B384T120T30 数据手册

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B384F120T30  
TM  
BCM  
Bus Converter  
• 384 V to 12 V V•I ChipTM Converter  
• 300 Watt (450 Watt for 1 ms)  
• High density – up to 1017 W/in3  
• Small footprint – 260 W/in2  
• Low weight – 0.5 oz (15 g)  
• Typical efficiency 95%  
• 125°C operation (TJ)  
©
• <1 µs transient response  
• >3.5 million hours MTBF  
• No output filtering required  
Vin = 360 - 400 V  
Vout = 11.3 - 12.5 V  
Iout = 25 A  
K = 1/32  
• ZVS / ZCS isolated sine  
amplitude converter  
Rout = 20.0 mΩ max  
Product Description  
Absolute Maximum Ratings  
The V•I Chip Bus Converter Module is a high efficiency  
(>95%), narrow input range Sine Amplitude Converter  
(SAC) operating from a 360 to 400 Vdc primary bus to  
deliver an isolated low voltage secondary (ELV).  
The off-line BCM provides an isolated 11.3 -12.5 V  
distribution bus and is ideal for use in silver boxes and  
PFC front ends. Due to the fast response time and low  
noise of the BCM, the need for limited life aluminum  
electrolytic or tantalum capacitors at the input of POL  
converters is reduced—or eliminated—resulting in  
savings of board area, materials and total system cost.  
Parameter  
Values  
-1.0 to 440  
500  
Unit  
Vdc  
Vdc  
Vdc  
Vdc  
Vdc  
A
Notes  
+In to -In  
+In to -In  
For 100 ms  
PC to -In  
-0.3 to 7.0  
-0.5 to 16.0  
4242  
+Out to -Out  
Isolation voltage  
Output current  
Peak output current  
Output power  
Peak output power  
Case temperature  
Operating junction temperature(1)  
Storage temperature  
Note:  
Input to Output  
Continuous  
For 1 ms  
27.7  
37.5  
A
300  
W
Continuous  
For 1 ms  
450  
W
The BCM achieves a power density of 1017 W/in3 in  
a V•I Chip package compatible with standard pick-and-  
place and surface mount assembly processes. The  
V•I Chip package provides flexible thermal management  
through its low junction-to-case and junction-to-board  
thermal resistance. Owing to its high conversion  
efficiency and safe operating temperature range, the  
BCM does not require a discrete heat sink in typical  
applications. Low junction-to-case and junction-to-lead  
thermal impedances assure low junction temperatures  
and long life in the harshest environments.  
225  
°C  
During reflow MSL 5  
T-Grade  
-40 to 125  
-40 to 125  
°C  
°C  
T-Grade  
(1) The referenced junction is defined as the semiconductor having the highest temperature.  
This temperature is monitored by a shutdown comparator.  
Part Numbering  
B
384  
F
120 T  
30  
Output Voltage  
Designator  
(=VOUT x10)  
Output Power  
Designator  
(=POUT/10)  
Bus Converter  
Module  
Input Voltage  
Designator  
Configuration  
F = J-lead  
Product Grade Temperatures (°C)  
Grade  
Storage Operating (TJ)  
T
-40 to125 -40 to125  
T = Through hole  
vicorpower.com  
800-735-6200  
V•I Chip Bus Converter Module  
B384F120T30  
Rev. 2.1  
Page 1 of 12  
1234567...12

中文翻译

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