B0530WS
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
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Features
Mechanical Data
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Low Forward Voltage Drop
Guard Ring Construction for Transient Protection
High Conductance
Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
Qualified to AEC-Q101 Standards for High Reliability
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Case: SOD-323
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe). Solderable per MIL-STD-202, Method 208
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Polarity: Cathode Band
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.004 grams (approximate)
Top View
Maximum Ratings @T = 25°C unless otherwise specified
A
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
VRRM
VRWM
VR
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
30
V
RMS Reverse Voltage
21
0.5
3.5
V
A
A
VR(RMS)
IO
Average Rectified Output Current (See Figure 1)
Peak Repetitive Forward Current tp = 8.3ms, half sine-wave
IFRM
Non-Repetitive Peak Forward Surge Current
8.3ms single half sine-wave superimposed on rated load
2
A
IFSM
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Symbol
PD
Value
235
Unit
mW
Typical Thermal Resistance Junction to Ambient (Note 1)
Operating and Storage Temperature Range
426
°C/W
°C
Rθ
TJ, TSTG
JA
-40 to +125
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Reverse Breakdown Voltage (Note 2)
Symbol
V(BR)R
Min
30
Typ
⎯
⎯
0.40
Max
⎯
0.36
0.45
Unit
V
Test Conditions
IR = 500μA
IF = 0.1A
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⎯
Forward Voltage Drop
V
VF
IF = 0.5A
VR = 15V
VR = 20V
VR = 30V
⎯
⎯
⎯
⎯
⎯
⎯
80
100
500
Leakage Current (Note 2)
Total Capacitance
IR
μA
58
pF
CT
⎯
⎯
f = 1MHz, VR = 0V DC
Notes:
1. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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www.diodes.com
December 2008
© Diodes Incorporated
B0530WS
Document number: DS30249 Rev. 13 - 2