B0530W
0.5A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Please click here to visit our online spice models database.
Features
Mechanical Data
•
•
•
•
Low Forward Voltage Drop
Guard Ring Die Construction for Transient Protection
High Conductance
Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
•
•
Case: SOD-123
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe) Solderable per MIL-STD-202, Method 208
•
•
•
•
•
•
Polarity: Cathode Band
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.01 grams (approximate)
Top View
Maximum Ratings @T = 25°C unless otherwise specified
A
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
VRRM
VRWM
VR
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
30
V
RMS Reverse Voltage
21
V
A
VR(RMS)
IO
0.5
Average Rectified Output Current
@ TL = 100°C
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
5.5
A
IFSM
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Symbol
PD
Value
410
Unit
mW
°C/W
°C
Typical Thermal Resistance Junction to Ambient (Note 1)
Operating and Storage Temperature Range
244
Rθ
JA
-65 to +125
TJ, TSTG
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Symbol
Value
Unit
Test Conditions
Minimum Reverse Breakdown Voltage (Note 2)
30
V
V(BR)R
IR = 130μA
IF = 0.1A, TJ = 25°C
IF = 0.5A, TJ = 25°C
VR = 15V, TJ = 25°C
VR = 30V, TJ = 25°C
f = 1MHz, VR = 0V DC
0.375
0.430
Maximum Forward Voltage Drop
V
VFM
20
130
Maximum Leakage Current (Note 2)
Total Capacitance
IRM
CT
μA
170
pF
Notes:
1. Device mounted on FR-4 PC board, 2"x2", 2 oz. Copper, single sided, Cathode pad dimensions 0.75"x1.0", Anode pad dimensions 0.25"x1.0".
2. Pulse Test: Pulse width = 300μs, Duty Cycle ≤ 2%.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
1 of 3
www.diodes.com
June 2008
© Diodes Incorporated
B0530W
Document number: DS30139 Rev. 9 - 2