AXS6
µSOCKET SERIES
IC SOCKETS FOR
SMALL OUTLINE
PACKAGE
SOP IC
SOCKETS
(AXS6)
initial production, and during actual
production the IC chips can be directly
mounted to the PC board without any
changes to the PC board patterns.
3. Space saving
The socket occupies an area only 1.25
times the size of the IC. High density
mounting is possible even if the socket is
used.
4. Automated mounting compatible
The socket has an open flat construction
on its top surface so that it can be picked
up by an automated mounting machine
using suction for automated mounting.
Socket frame
SO package IC chip
Socket body
APPLICATIONS
1. For initial production (prototyping to
initial production stages, which use
sockets for fast production of a new
product)
2. For functional upgrades (situations
requiring ROM replacement or LSI chip
replacement)
2. Achieves a mounting height of 5mm
or less including the IC’s height
The maximum height is 5mm, even when
taking into consideration the rise in
cream solder and the IC’s maximum
height. Ideal for low-profile requirements.
Socket height: 4.5mm (28, 32 and 40
contact)
FEATURES
1. Requires no pattern changes when
directly mounting an IC
The foot patterns of SO package IC chips
and of the socket are identical. Thus, the
sockets can be used from prototyping to
Socket height: 4.2mm (8, 20 and 24
contact)
VENDOR-CLASSIFIED COMPATIBILITY LIST FOR SOP IC SOCKETS
Please consult us for compatibility with other IC models.
No. of
contacts
Nominal dimensions
300 mil
Applicable Ics (IC maker: Part No.)
8
• FUJITSU: FPT-8P-M01
• TI: PS008
• NEC: P14GM-50-300B-2
• MITSUBISHI: 14P2W
• TOSHIBA: SOP14-P-300
• TI: PS014
• HITACHI: FP-14D, FP-14DA
• FUJITSU: FPT-14P-M04
• MOTOROLA: 751A-02
14
300 mil
300 mil
• NEC: P20GM-50-300B, P20GM-50-300C-2
• MEC: SONF-20D
• HITACHI: FP-20DA, FP-20DN
20
24
• NEC: P20GM-50-375B-3, P20GT-50-375B-2
• MOTOROLA: 751D-03
• FUJITSU: FPT-20P-M02
• ATMEL: 20S
375 mil
300 mil
375 mil
• NEC: P24GM-50-300B-2
• NEC: P28GM-50-375B-2, P28GT-50-375B-2
• MITSUBISHI: 28P2V-A
• FUJITSU: FPT-28P-M01
• MOTOROLA: 751F-02
• TOSHIBA: SOP28-P-450
• OKI IC: SOP28-P-430-K
ATMEL: 28R
Standard frame
28
32
450 mil
• NEC: P28GM-50-450A1-2, P28GM-50-450A2-2
Centering frame • HITACHI: FP-28D, FP-28DA
• MEC: SOP028-P-0425
• SHARP: SOP28-P-450
• MITSUBISHI: 28P2W-A, 28P2W-C
450 mil
525 mil
• FUJITSU: FPT-32P-M02
• TOSHIBA: SOP32-P-450
• NEC: S32GM-50-525A-2
• MITSUBISHI: 32P2M-A
• TOSHIBA: SOP32-P-525
• MACRONIX: MX27C1000MC-90
• HITACHI: FP-32D
• FUJITSU: FPT-32P-M03
• SANYO: 3205
40
44
525 mil
600 mil
• HITACHI: FP-40D
• MITSUBISHI: 40P2M-A
• INTEL: 231369-80
• NEC: P44GX-50-600A
Notes) 1. The centering frame is used to secure ICs which are too small to be secured with the standard frame. The centering frame has inward
projections in the center portion. For easy identification, the centering frame is a sky gray color, whereas the standard frame is a creamy gray
color.
2. The contents of this compatibility list are valid as of July, 2002.
169
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