For board-to-FPC
Narrow pitch connectors
(0.4mm pitch)
A4US Series
FEATURES
1. Slim body width of 2.0 mm/2.2 mm
contributes to space-saving.
2. A wide lineup contributes to the
design freedom.
3. “
” ensures
high resistance to various
environments in lieu of its space-
saving footprint.
Soldering terminals
at each corner
Ni barrier
construction
Bellows contact
construction
(Against solder rise!)
(Against dropping!)
Suction face
Socket
Header
Porosity treatment
(Against corrosive gases!)
RoHS compliant
Socket
Soldering terminals
at each corner
V notch and Double contact constructions
(Against foreign particles and flux!)
Suction face
4. Simple lock structure provides
tactile feedback to ensure excellent
mating/unmating operation feel.
5. Soldering terminals at each corner
enhance mounting strength.
Header
6. Gull-wing-shaped terminals to
facilitate visual inspections.
Unit: mm
Mated height
Width for socket
0.8
–
1.0
✩
1.5
✩
APPLICATIONS
2.2
2.0
Suitable for board-to-FPC connections
in mobile equipment that requires size
and thickness reduction and
w
Ne
Socket
✩
–
–
0.6
0.7
0.64
0.76
Suction
face
Header
functionality enhancement.
ORDERING INFORMATION
■ 0.8 mm
■ 1.0 mm, 1.5 mm
AXE
2
D
AXE
2
4
D
1: Socket
2: Header
1: Socket
2: Header
Number of pins (2 digits)
Number of pins (2 digits)
Mated height/Width
Mated height/Width
<Socket>
<Socket>
5: 0.8 mm mated height/2.0 mm width
<Header>
2: 1.0 mm, 1.5 mm mated height/2.2 mm width
<Header>
1: 0.8 mm mated height/2.0 mm width
2: 1.0 mm mated height/2.2 mm width
3: 1.5 mm mated height/2.2 mm width
Functions
2: Without positioning bosses
Functions
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket>
7: Base: Ni plating, Surface: Au plating (for Ni barrier available)
<Header>
Surface treatment (Contact portion / Terminal portion)
<Socket>
4: Base: Ni plating, Surface: Au plating (for Ni barrier available)
<Header>
4: Base: Ni plating, Surface: Au plating
4: Base: Ni plating, Surface: Au plating
Package
D: Embossed packaging (4 mm pitch)
Package
D: Embossed packaging (4 mm pitch)
ACCTB4E 201409-T
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