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AWT6275RM20P9 PDF预览

AWT6275RM20P9

更新时间: 2024-10-04 06:38:47
品牌 Logo 应用领域
ANADIGICS 电信集成电路放大器功率放大器
页数 文件大小 规格书
8页 396K
描述
HELPTM IMT/WCDMA 3.4V/27.5dBm Linear Power Amplifier Module

AWT6275RM20P9 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:BCC包装说明:HQCCN,
针数:10Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.62
JESD-30 代码:S-XBCC-N10长度:4 mm
功能数量:1端子数量:10
封装主体材料:UNSPECIFIED封装代码:HQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:1.08 mm标称供电电压:3.4 V
表面贴装:YES电信集成电路类型:RF AND BASEBAND CIRCUIT
端子形式:NO LEAD端子节距:0.85 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:4 mmBase Number Matches:1

AWT6275RM20P9 数据手册

 浏览型号AWT6275RM20P9的Datasheet PDF文件第2页浏览型号AWT6275RM20P9的Datasheet PDF文件第3页浏览型号AWT6275RM20P9的Datasheet PDF文件第4页浏览型号AWT6275RM20P9的Datasheet PDF文件第5页浏览型号AWT6275RM20P9的Datasheet PDF文件第6页浏览型号AWT6275RM20P9的Datasheet PDF文件第7页 
AWT6275  
HELPTM IMT/WCDMA 3.4V/27.5dBm  
Linear Power Amplifier Module  
Data Sheet - Rev 2.2  
FEATURES  
InGaP HBT Technology  
High Efficiency:  
43% @ POUT = +27.5 dBm  
21% @ POUT = +16 dBm  
15% @ POUT = +7 dBm  
Low Quiescent Current: 16 mA  
Low Leakage Current in Shutdown Mode:<1 mA  
VREF = +2.85 V (+2.75 V min over temp)  
Optimized for a 50 V System  
Low Profile Miniature Surface Mount Package  
RoHS Compliant Package, 250 oC MSL-3  
HSPA Capable  
A
W
T6275  
APPLICATIONS  
WCDMA/HSPA IMT-Band Wireless Handsets  
and Data Devices  
M20 Package  
10 Pin 4 mm x 4 mm x 1 mm  
Surface Mount Module  
PRODUCT DESCRIPTION  
The AWT6275 meets the increasing demands for  
higher output power in UMTS handsets. The PA  
module is optimized for VREF = +2.85 V, a require-  
ment for compatibility with the Qualcomm® 6250  
chipset. The device is manufactured on an ad-  
vanced InGaP HBT MMIC technology offering  
state-of-the-art reliability, temperature stability, and  
ruggedness. Selectable bias modes that optimize  
efficiency for different output power levels, and a  
shutdown mode with low leakage current, increase  
handset talk and standby time. The self-contained  
4 mm x 4 mm x 1 mm surface mount package  
incorporates matching networks optimized for output  
power, efficiency, and linearity in a 50 V system.  
GND at slug (pad)  
1
2
3
4
5
10  
9
VCC  
RFIN  
VCC  
GND  
RFOUT  
GND  
GND  
8
GND  
VMODE  
VREF  
Bias Control  
7
6
Figure 1: Block Diagram  
11/2008  

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