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AWT6251M7P8 PDF预览

AWT6251M7P8

更新时间: 2024-11-18 03:19:55
品牌 Logo 应用领域
ANADIGICS 放大器射频微波功率放大器过程控制系统PCS
页数 文件大小 规格书
12页 295K
描述
PCS/WCDMA 3.4V/27.5 dBm Linear Power Amplifier Module

AWT6251M7P8 数据手册

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AWT6251  
PCS/WCDMA 3.4V/27.5 dBm  
Linear PowerAmplifier Module  
PRELIMINARY DATASHEET - Rev 1.3  
FEATURES  
InGaP HBT Technology  
High Efficiency: 38%  
Low Quiescent Current: 50 mA  
Low Leakage Current in Shutdown Mode: <1 µA  
VREF = +2.85 V (+2.75 V min over temp)  
A
WT6251  
Optimized for a 50 System  
Low Profile Miniature Surface Mount Package:  
1.56 mm Max  
o
RoHS Compliant Package Option, 250 C MSL-3  
APPLICATIONS  
Dual Mode 3GPP Wireless Handsets  
M7 Package  
10 Pin 4 mm x 4 mm x 1.5 mm  
Surface Mount Module  
PRODUCT DESCRIPTION  
The AWT6251 meets the increasing demands for  
higher output power in 3GPP handsets. The PAmodule  
is optimized for VREF = +2.85 V, a requirement for  
compatibility with the Qualcomm® 6250 chipset. The  
device is manufactured on an advanced InGaP HBT  
MMIC technology offering state-of-the-art reliability,  
temperature stability, and ruggedness. Selectable  
bias modes that optimize efficiency for different output  
power levels, and a shutdown mode with low leakage  
current, increase handset talk and standby time. The  
self-contained 4 mm x 4 mm x 1.5 mm surface mount  
package incorporates matching networks optimized  
for output power, efficiency, and linearity in a 50 Ω  
system.  
GND at slug (pad)  
1
2
3
4
5
10  
9
V
CC  
V
CC  
RFIN  
GND  
RFOUT  
GND  
GND  
8
GND  
Bias Control  
7
V
MODE  
6
V
REF  
Figure 1: Block Diagram  
06/2005  

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