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AWT6222 PDF预览

AWT6222

更新时间: 2024-11-18 06:38:47
品牌 Logo 应用领域
ANADIGICS 放大器功率放大器蜂窝
页数 文件大小 规格书
8页 388K
描述
HELP3TM Tri-band US Cellular/Japan Cellular/IMT UMTS/WCDMA Linear Power Amplifier Module

AWT6222 数据手册

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AWT6222  
HELP3TM Tri-band  
US Cellular/Japan Cellular/IMT  
UMTS/WCDMA Linear Power Amplifier Module  
Data Sheet - Rev 2.1  
FEATURES  
InGaP HBT Technology  
High Efficiency:  
22 % @ +16 dBm POUT  
(without DC/DC converter)  
40 % @ maximum POUT  
Low Quiescent Current: 8 mA  
Internal Voltage Regulation  
Common VMODE Control Line  
Simplified VCC Bus PCB routing  
Reduced External Component Count  
Low Profile Surface Mount Package: 1 mm  
HSDPA Compliant  
A
W
T6222  
RoHS Compliant Package, 250 oC MSL-3  
APPLICATIONS  
WCDMA/HSPA JCell/IMT Dual-Band Wireless  
Handsets and Data Devices  
M28 Package  
14 Pin 3 mm x 5 mm x 1 mm  
Surface Mount Module  
PRODUCT DESCRIPTION  
The AWT6222 addresses the demand for increased  
integration in dual-band handsets for cellular network  
deployments. The small footprint 3 mm x 5 mm  
x 1 mm surface mount RoHS compliant package  
contains independent RF PA paths to ensure optimal  
performance in both frequency bands, while achieving  
a 25% PCB space savings compared with solutions  
requiring two single-band PAs. The package pinout  
was chosen to enable handset manufacturers  
to easily route VCC to both power amplifiers and  
simplify control with a common VMODE pin. The  
device is manufactured on an advanced InGaP HBT  
MMIC technology offering state-of-the-art reliability,  
temperature stability, and ruggedness. TheAWT6222  
incorporates ANADIGICS’ HELP3™ technology to  
provide low power consumption without the need for  
an external voltage regulator. Two operating modes  
provide optimum efficiency at high and medium/low  
power output levels, thereby dramatically increasing  
handset talk-time and standby-time. Its built-in voltage  
regulator eliminates the need for external voltage  
regulation and load switches. The 3 mm x 5 mm x 1  
mm surface mount package incorporates matching  
networks optimized for output power, efficiency and  
linearity in a 50 system.  
GND at slug (pad)  
V
EN_CELL  
1
2
14  
13  
12  
11  
10  
9
GND  
Bias Control  
RFIN_CELL  
RFOUT_CELL  
V
MODE1  
3
4
5
V
CC  
CC  
V
BATT  
V
A
V
MODE2 (N/C)  
GND  
RFIN_IMT  
GND  
6
7
Bias Control  
V
EN_IMT  
8
RFOUT_IMT  
GND  
Figure 1: Block Diagram  
11/2008  

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