Datasheet > AWT6131M7P8

AWT6131M7P8

更新时间： 2024-11-17 03:19:55

品牌	Logo	应用领域
ANADIGICS		电信集成电路放大器功率放大器过程控制系统 PCS
页数	文件大小	规格书
12页	206K
描述
PCS/CDMA 3.5V/29dBm Linear Power Amplifier Module

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技术参数
数据手册

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AWT6131M7P8 技术参数

生命周期：	Transferred	包装说明：	HLSON,
Reach Compliance Code：	unknown	HTS代码：	8542.39.00.01
风险等级：	5.75	JESD-30 代码：	S-XDSO-N10
长度：	4 mm	功能数量：	1
端子数量：	10	封装主体材料：	UNSPECIFIED
封装代码：	HLSON	封装形状：	SQUARE
封装形式：	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE	认证状态：	Not Qualified
座面最大高度：	1.56 mm	标称供电电压：	3.5 V
表面贴装：	YES	电信集成电路类型：	RF AND BASEBAND CIRCUIT
端子形式：	NO LEAD	端子节距：	0.85 mm
端子位置：	DUAL	宽度：	4 mm
Base Number Matches：	1

AWT6131M7P8 数据手册

AWT6131

PCS/CDMA 3.5V/29dBm

Linear Power Amplifier Module

PRELIMINARY DATA SHEET - Rev 1.0

FEATURES

•

InGaP HBT Technology

High Efficiency: 37%

Low Quiescent Current: 50 mA

Low Leakage Current in Shutdown Mode: <1 µA

Optimized for a 50 Ω System

Low Profile Miniature Surface Mount Package:

1.56mm Max

•

CDMA 1XRTT Compliant

CDMA 1xEV-DO Compliant

APPLICATIONS

•

PCS CDMA Wireless Handsets

M7 Package

10 Pin 4mm x 4mm

Surface Mount Module

Dual Band CDMA Wireless Handsets

Tri Mode CDMA Handsets with GPS

PRODUCT DESCRIPTION

The AWT6131 provides the additional output power

margin RF designers need to overcome additional

post-PA insertion loss in tri-mode handset designs

supporting E911 (GPS enabled). The device is

manufactured on an advanced InGaP HBT MMIC

technology offering state-of-the-art reliability,

temperature stability, and ruggedness. Selectable

bias modes that optimize efficiency for different output

power levels, and a shutdown mode with low leakage

current, increase handset talk and standby time. The

self-contained 4mm x 4mm surface mount package

incorporates matching networks optimized for output

power, efficiency, and linearity in a 50 Ω system.

GND at slug (pad)

VCC

RFIN

GND

RFOUT

GND

Bias Control

MODE

REF

Figure 1: Block Diagram

11/2002

12 3 4 5 6 7...12

中文翻译

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