AWB7222
1.805 - 1.880 GHz
Small-Cell Power Amplifier Module
DATA SHEET - Rev 2.3
FEATURES
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InGaP HBT Technology
-47 dBc ACPR @ ±10 MHz, +27 dBm
32 dB Gain
High Efficiency
Low Transistor Junction Temperature
Matched for a 50 Ω System
Low Profile Miniature Surface Mount Package;
RoHS Compliant
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Multi-Carrier Capability
APPLICATIONS
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WCDMA, HSDPA and LTE Air Interfaces
Picocell, Femtocell, Home Nodes
Customer Premises Equipment (CPE)
Data Cards and Terminals
14 Pin 7 mm x 7 mm x 1.3 mm
Surface Mount Module
PRODUCT DESCRIPTION
from a convenient +4.5 V supply and provides 32 dB of
gain. The device is manufactured using an advanced
InGaP HBT MMIC technology offering state-of-the-
art reliability, temperature stability, and ruggedness.
The self-contained 7 mm x 7 mm x 1.3 mm surface
mount package incorporates RF matching networks
optimized for output power, efficiency, and linearity in
a 50 Ω system.
The AWB7222 is a fully matched, Multi-Chip-Module
(MCM) designed for picocell, femtocell, and customer
premises equipment (CPE) applications. Its high
linearity and efficiency meet the extremely demanding
needs of small cell infrastructure architectures.
Designed for WCDMA, HSDPA, and LTE air interfaces
operating in the 1.805 GHz to 1.880 GHz band, the
AWB7222 delivers up to +27 dBm of LTE (E-TM1.1)
power with an ACPR better than -47 dBc. It operates
Vcc 1
Vcc 2
Matching
Network
Matching
Network
RF Input
Bias
Network
Matching
Network
Matching
Network
RF Output
Power
Detector
Bias
Network
V
REF
V
DET
Figure 1: Block Diagram
05/2015