AMMC - 5618
6 - 20 GHz Amplifier
Data Sheet
Description
Avago Technologies’ AMMC-5618 6-20 GHz MMIC is an
efficient two-stage amplifier designed to be used as a
cascadable intermediate gain block for EW applications.
In communication systems, it can be used as a LO buffer,
or as a transmit driver amplifier. It is fabricated using a
PHEMT integrated circuit structure that provides excep-
tional efficiency and flat gain performance. During typi-
cal operation with a single 5-V supply, each gain stage
is biased for Class-A operation for optimal power output
with minimal distortion. The RF input and output have
matching circuitry for use in 50-W environments. The
backside of the chip is both RF and DC ground. This helps
simplify the assembly process and reduces assembly re-
lated performance variations and costs. For improved re-
liability and moisture protection, the die is passivated at
the active areas. The MMIC is a cost effective alternative
to hybrid (discrete FET) amplifiers that require complex
tuning and assembly processes.
Chip Size: 920 x 920 µm (36.2 x 36.2 mils)
Chip Size Tolerance: ± 10µm (±0.4 mils)
Chip Thickness: 100 ± 10µm (4 ± 0.4 mils)
Pad Dimensions: 80 x 80 µm (3.1 x 3.1 mils or larger)
Features
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•
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Frequency Range: 6 - 20 GHz
AMMC-5618 Absolute Maximum Ratings [1]
High Gain: 14.5 dB Typical
Symbol Parameters/ Conditions Units Min. Max.
Output Power: 19.5 dBm Typical
Input and Output Return Loss: < -12 dB
Flat Gain Response: ± 0.3 dB Typical
Single Supply Bias: 5 V @ 107 mA
VD1, VD2 Drain Supply Voltage
V
7
VG1
VG2
ID1
ID2
Pin
Tch
Tb
Optional Gate Voltage
Optional Gate Voltage
Drain Supply Current
Drain Supply Current
RF Input Power
V
-5
-5
+1
+1
70
V
mA
mA
dBm
°C
84
Applications
20
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•
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Driver/Buffer in microwave communication systems
Channel Temp.
+150
Cascadable gain stage for EW systems
Phased array radar and transmit amplifiers
Operating Backside
Temp.
°C
-55
Tstg
Storage Temp.
°C
°C
-65 +165
+300
Tmax
Maximum Assembly
Temp. (60 sec max)
Note:
1. Operation in excess of any one of these conditions may result in
permanent damage to this device.
Note: These devices are ESD sensitive. The following precautions are strongly recommended:
Ensure that an ESD approved carrier is used when dice are transported from one destination to another.
Personal grounding is to be worn at all times when handling these devices.