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AUIRLR014N PDF预览

AUIRLR014N

更新时间: 2024-01-23 10:15:12
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 396K
描述
Power Field-Effect Transistor, N-Channel, Metal-Oxide Semiconductor FET

AUIRLR014N 技术参数

是否Rohs认证: 符合生命周期:Transferred
包装说明:,Reach Compliance Code:unknown
风险等级:5.14配置:Single
最大漏极电流 (Abs) (ID):10 AFET 技术:METAL-OXIDE SEMICONDUCTOR
最高工作温度:175 °C极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):28 W子类别:FET General Purpose Power
表面贴装:YESBase Number Matches:1

AUIRLR014N 数据手册

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AUTOMOTIVE GRADE  
AUIRLR014N  
Features  
HEXFET® Power MOSFET  
Advanced Planar Technology  
Logic Level Gate Drive  
Low On-Resistance  
Dynamic dV/dT Rating  
175°C Operating Temperature  
Fast Switching  
VDSS  
RDS(on)  
ID  
55V  
max.  
0.14  
Fully Avalanche Rated  
10A  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free, RoHS Compliant  
Automotive Qualified *  
D
Description  
S
Specifically designed for Automotive applications, this cellular  
design of HEXFET® Power MOSFETs utilizes the latest  
processing techniques to achieve low on-resistance per silicon  
area. This benefit combined with the fast switching speed and  
ruggedized device design that HEXFET power MOSFETs are well  
known for, provides the designer with an extremely efficient and  
reliable device for use in Automotive and a wide variety of other  
applications.  
G
G
D
S
Gate  
Drain  
Source  
Standard Pack  
Form  
Tube  
Base part number  
Package Type  
Orderable Part Number  
Quantity  
75  
3000  
AUIRLR014N  
AUIRLR014NTRL  
AUIRLR014N  
D-Pak  
Tape and Reel Left  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress  
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance  
and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless  
otherwise specified.  
Symbol  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
Continuous Drain Current, VGS @ 10V  
10  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
7.1  
40  
A
PD @TC = 25°C  
Maximum Power Dissipation  
Linear Derating Factor  
28  
W
0.2  
W/°C  
VGS  
EAS  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy (Thermally Limited)   
± 16  
35  
V
mJ  
A
IAR  
Avalanche Current   
6.0  
2.8  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy   
Peak Diode Recovery  
mJ  
V/ns  
5.0  
Operating Junction and  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds (1.6mm from case)  
°C  
300  
Thermal Resistance  
Symbol  
Parameter  
Junction-to-Case   
Typ.  
–––  
–––  
–––  
Max.  
5.3  
Units  
RJC  
RJA  
RJA  
Junction-to-Ambient ( PCB Mount)   
Junction-to-Ambient  
50  
°C/W  
110  
HEXFET® is a registered trademark of Infineon.  
*Qualification standards can be found at www.infineon.com  
1
2015-12-11  

AUIRLR014N 替代型号

型号 品牌 替代类型 描述 数据表
AUIRLR014NTRL INFINEON

完全替代

Power Field-Effect Transistor, N-Channel, Metal-Oxide Semiconductor FET
IRLR024NTRPBF INFINEON

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Advanced Process Technology
IRLR024NPBF INFINEON

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HEXFET Power MOSFET

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