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AUIRLI2505 PDF预览

AUIRLI2505

更新时间: 2024-09-28 14:40:59
品牌 Logo 应用领域
英飞凌 - INFINEON 局域网开关脉冲晶体管
页数 文件大小 规格书
11页 242K
描述
Power Field-Effect Transistor, 58A I(D), 55V, 0.01ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET

AUIRLI2505 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:,Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.36
其他特性:AVALANCHE RATED, FAST SWITCHING雪崩能效等级(Eas):500 mJ
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:55 V最大漏极电流 (Abs) (ID):58 A
最大漏极电流 (ID):58 A最大漏源导通电阻:0.01 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR元件数量:1
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):63 W最大脉冲漏极电流 (IDM):360 A
参考标准:AEC-Q101子类别:FET General Purpose Power
表面贴装:NO处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

AUIRLI2505 数据手册

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PD - 97766  
AUTOMOTIVE GRADE  
AUIRLI2505  
Features  
l
Advanced Planar Technology  
HEXFET® Power MOSFET  
l
l
l
l
l
l
l
Logic-Level Gate Drive  
Low On-Resistance  
Dynamic dv/dt Rating  
175°C Operating Temperature  
Fast Switching  
Fully Avalanche Rated  
Repetitive Avalanche Allowed up to  
Tjmax  
V(BR)DSS  
55V  
RDS(on) max. 8.0m  
ID  
58A  
l
l
Lead-Free, RoHS Compliant  
Automotive Qualified*  
Description  
Specifically designed for Automotive applications,  
this cellular design of HEXFET® Power MOSFETs  
utilizes the latest processing techniques to achieve  
low on-resistance per silicon area. This benefit  
combined with the fast switching speed and rug-  
gedized device design that HEXFET power  
MOSFETs are well known for, provides the de-  
signer with an extremely efficient and reliable de-  
vice for use in Automotive and a wide variety of  
other applications.  
S
D
G
TO-220AB Full-Pak  
AUIRLI2505  
G
Gate  
D
Drain  
S
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect  
device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air  
conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Max.  
58  
Parameter  
Units  
Continuous Drain Current, VGS @ 10V  
@ T = 25°C  
C
I
I
I
D
D
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
41  
A
@ T = 100°C  
C
360  
DM  
63  
Power Dissipation  
@T = 25°C  
C
W
W/°C  
V
P
D
0.42  
± 16  
Linear Derating Factor  
Gate-to-Source Voltage  
V
GS  
EAS  
IAR  
500  
54  
Single Pulse Avalanche Energy (Thermally Limited)  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
6.3  
5.0  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
mJ  
V/ns  
-55 to + 175  
T
T
J
Storage Temperature Range  
°C  
STG  
300  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Mounting Torque, 6-32 or M3 screw  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
Max.  
2.4  
65  
Units  
°C/W  
RJC  
RJA  
Junction-to-Case  
Junction-to-Ambient  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
03/14/12  

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