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AUIRGSL30B60K PDF预览

AUIRGSL30B60K

更新时间: 2024-09-14 14:47:51
品牌 Logo 应用领域
英飞凌 - INFINEON 电动机控制晶体管
页数 文件大小 规格书
15页 301K
描述
Insulated Gate Bipolar Transistor, 78A I(C), 600V V(BR)CES, N-Channel, TO-262AA, ROHS COMPLIANT, TO-262, 3 PIN

AUIRGSL30B60K 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:IN-LINE, R-PSIP-T3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.71
最大集电极电流 (IC):78 A集电极-发射极最大电压:600 V
配置:SINGLE最大降落时间(tf):42 ns
门极发射器阈值电压最大值:5.5 V门极-发射极最大电压:20 V
JEDEC-95代码:TO-262AAJESD-30 代码:R-PSIP-T3
湿度敏感等级:1元件数量:1
端子数量:3最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):370 W
认证状态:Not Qualified最大上升时间(tr):39 ns
子类别:Insulated Gate BIP Transistors表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:MOTOR CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):237 ns
标称接通时间 (ton):74 nsBase Number Matches:1

AUIRGSL30B60K 数据手册

 浏览型号AUIRGSL30B60K的Datasheet PDF文件第2页浏览型号AUIRGSL30B60K的Datasheet PDF文件第3页浏览型号AUIRGSL30B60K的Datasheet PDF文件第4页浏览型号AUIRGSL30B60K的Datasheet PDF文件第5页浏览型号AUIRGSL30B60K的Datasheet PDF文件第6页浏览型号AUIRGSL30B60K的Datasheet PDF文件第7页 
PD - 96334  
AUTOMOTIVE GRADE  
AUIRGS30B60K  
AUIRGSL30B60K  
VCES = 600V  
INSULATED GATE BIPOLAR TRANSISTOR  
C
Features  
• Low VCE(on) Non Punch Through IGBT Technology  
• 10µs Short Circuit Capability  
• Square RBSOA  
IC = 50A, TC=100°C  
atTJ=175°C  
G
t
sc > 10µs, TJ=150°C  
• Positive VCE(on) Temperature Coefficient  
• Maximum Junction Temperature rated at 175°C  
• Lead-Free, RoHS Compliant  
• Automotive Qualified *  
E
VCE(on) typ. = 1.95V  
n-channel  
Benefits  
• Benchmark Efficiency for Motor Control  
• Rugged Transient Performance  
• Low EMI  
D2Pak  
AUIRGS30B60K  
TO-262  
AUIRGSL30B60K  
• Excellent Current Sharing in Parallel Operation  
G
C
E
Gate  
Collector  
Emitter  
AbsoluteMaximumRatings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the  
device. These are stress ratings only; and functional operation of the device at these or any other condition  
beyond those indicated in the specifications is not implied.Exposure to absolute-maximum-rated conditions  
for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are  
measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise  
specified  
Parameter  
Collector-to-Emitter Voltage  
Max.  
600  
Units  
V
VCES  
Continuous Collector Current  
Continuous Collector Current  
Pulse Collector Current (Ref.Fig.C.T.5)  
Clamped Inductive Load current  
RMS Isolation Voltage, Terminal to Case, t=1 min.  
Gate-to-Emitter Voltage  
78  
IC @ TC = 25°C  
50  
A
IC @ TC = 100°C  
120  
ICM  
120  
ILM  
2500  
±20  
V
VISOL  
VGE  
Maximum Power Dissipation  
370  
W
PD @ TC = 25°C  
Maximum Power Dissipation  
180  
PD @ TC = 100°C  
Operating Junction and  
-55 to +175  
TJ  
Storage Temperature Range  
Soldering Temperature, for 10 sec.  
°C  
TSTG  
300 (0.063 in. (1.6mm) from case)  
Thermal / Mechanical Characteristics  
Parameter  
Min.  
–––  
–––  
–––  
–––  
Typ.  
–––  
Max.  
0.41*  
–––  
Units  
Rθ  
JC  
Rθ  
CS  
Rθ  
JA  
Junction-to-Case- IGBT  
°C/W  
Case-to-Sink, flat, greased surface  
Junction-to-Ambient (PCB Mount, Steady State)  
Weight  
0.50  
–––  
40  
1.44  
–––  
g
Wt  
* RθJC (end of life) = 0.65°C/W. This is the maximum measured value after 1000 temperature cycles from -55 to 150°C  
and is accounted for by the physical wearout of the die attach medium.  
www.irf.com  
1
10/14/10  

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