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AUIRFS3004TRR

更新时间: 2024-09-27 12:30:11
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
13页 295K
描述
Advanced Process Technology Ultra Low On-Resistance

AUIRFS3004TRR 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.14
Is Samacsys:N其他特性:AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
雪崩能效等级(Eas):300 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:40 V
最大漏极电流 (Abs) (ID):195 A最大漏极电流 (ID):195 A
最大漏源导通电阻:0.00175 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):380 W
最大脉冲漏极电流 (IDM):1310 A子类别:FET General Purpose Power
表面贴装:YES端子面层:MATTE TIN OVER NICKEL
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

AUIRFS3004TRR 数据手册

 浏览型号AUIRFS3004TRR的Datasheet PDF文件第2页浏览型号AUIRFS3004TRR的Datasheet PDF文件第3页浏览型号AUIRFS3004TRR的Datasheet PDF文件第4页浏览型号AUIRFS3004TRR的Datasheet PDF文件第5页浏览型号AUIRFS3004TRR的Datasheet PDF文件第6页浏览型号AUIRFS3004TRR的Datasheet PDF文件第7页 
PD - 96400A  
AUTOMOTIVE GRADE  
AUIRFS3004  
AUIRFSL3004  
HEXFET® Power MOSFET  
40V  
Features  
l
Advanced Process Technology  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
Automotive Qualified *  
D
S
l
l
l
l
l
l
VDSS  
RDS(on) typ.  
max.  
1.4m  
1.75m  
Ω
Ω
G
ID  
340A  
(Silicon Limited)  
ID  
195A  
(Package Limited)  
Description  
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniques to achieve extremely low on-resistance per  
siliconarea. Additionalfeaturesofthisdesign area175°C  
junctionoperatingtemperature, fastswitchingspeedand  
improved repetitive avalanche rating . These features  
combine to make this design an extremely efficient and  
reliable device for use in Automotive applications and a  
D
D
S
S
D
G
G
D2Pak  
AUIRFS3004  
TO-262  
AUIRFSL3004  
wide variety of other applications.  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Stressesbeyondthoselistedunder“AbsoluteMaximumRatings”maycausepermanentdamagetothedevice.Thesearestress  
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications  
is not implied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. Thethermal  
resistanceandpowerdissipationratingsaremeasuredunderboardmountedandstillairconditions.Ambienttemperature(TA)  
is 25°C, unless otherwise specified.  
Parameter  
Max.  
340  
Units  
A
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
240  
195  
1310  
Pulsed Drain Current  
PD @TC = 25°C  
W
380  
Maximum Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
2.5  
W/°C  
V
VGS  
± 20  
4.4  
300  
Peak Diode Recovery  
Single Pulse Avalanche Energy  
dv/dt  
EAS (Thermally limited)  
V/ns  
mJ  
A
Avalanche Current  
IAR  
See Fig. 14, 15, 22a, 22b  
Repetitive Avalanche Energy  
EAR  
TJ  
mJ  
-55 to + 175  
300  
Operating Junction and  
TSTG  
°C  
Storage Temperature Range  
Soldering Temperature, for 10 seconds (1.6mm from case)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
0.40  
40  
Units  
RθJC  
Junction-to-Case  
°C/W  
Junction-to-Ambient (PCB Mount) , D2Pak  
RθJA  
–––  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
10/4/11  

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