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AUIRFS3004TRL PDF预览

AUIRFS3004TRL

更新时间: 2024-02-21 04:42:49
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
13页 295K
描述
Advanced Process Technology Ultra Low On-Resistance

AUIRFS3004TRL 数据手册

 浏览型号AUIRFS3004TRL的Datasheet PDF文件第2页浏览型号AUIRFS3004TRL的Datasheet PDF文件第3页浏览型号AUIRFS3004TRL的Datasheet PDF文件第4页浏览型号AUIRFS3004TRL的Datasheet PDF文件第5页浏览型号AUIRFS3004TRL的Datasheet PDF文件第6页浏览型号AUIRFS3004TRL的Datasheet PDF文件第7页 
PD - 96400A  
AUTOMOTIVE GRADE  
AUIRFS3004  
AUIRFSL3004  
HEXFET® Power MOSFET  
40V  
Features  
l
Advanced Process Technology  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
Automotive Qualified *  
D
S
l
l
l
l
l
l
VDSS  
RDS(on) typ.  
max.  
1.4m  
1.75m  
Ω
Ω
G
ID  
340A  
(Silicon Limited)  
ID  
195A  
(Package Limited)  
Description  
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniques to achieve extremely low on-resistance per  
siliconarea. Additionalfeaturesofthisdesign area175°C  
junctionoperatingtemperature, fastswitchingspeedand  
improved repetitive avalanche rating . These features  
combine to make this design an extremely efficient and  
reliable device for use in Automotive applications and a  
D
D
S
S
D
G
G
D2Pak  
AUIRFS3004  
TO-262  
AUIRFSL3004  
wide variety of other applications.  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Stressesbeyondthoselistedunder“AbsoluteMaximumRatings”maycausepermanentdamagetothedevice.Thesearestress  
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications  
is not implied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. Thethermal  
resistanceandpowerdissipationratingsaremeasuredunderboardmountedandstillairconditions.Ambienttemperature(TA)  
is 25°C, unless otherwise specified.  
Parameter  
Max.  
340  
Units  
A
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
240  
195  
1310  
Pulsed Drain Current  
PD @TC = 25°C  
W
380  
Maximum Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
2.5  
W/°C  
V
VGS  
± 20  
4.4  
300  
Peak Diode Recovery  
Single Pulse Avalanche Energy  
dv/dt  
EAS (Thermally limited)  
V/ns  
mJ  
A
Avalanche Current  
IAR  
See Fig. 14, 15, 22a, 22b  
Repetitive Avalanche Energy  
EAR  
TJ  
mJ  
-55 to + 175  
300  
Operating Junction and  
TSTG  
°C  
Storage Temperature Range  
Soldering Temperature, for 10 seconds (1.6mm from case)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
0.40  
40  
Units  
RθJC  
Junction-to-Case  
°C/W  
Junction-to-Ambient (PCB Mount) , D2Pak  
RθJA  
–––  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
10/4/11  

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