PD - 97704A
AUTOMOTIVE GRADE
AUIRFS3004-7P
HEXFET® Power MOSFET
Features
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Advanced Process Technology
D
VDSS
RDS(on) typ.
40V
0.90m
1.25m
400A
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
max.
G
ID
ID
(Silicon Limited)
240A
S
(Package Limited)
Description
Specifically designed for Automotive applications, this
HEXFET® Power MOSFET utilizes the latest processing
techniques to achieve extremely low on-resistance per
silicon area. Additional features of this design are a 175°C
junction operating temperature, fast switching speed and
improved repetitive avalanche rating. These features
combine to make this design an extremely efficient and
reliable device for use in Automotive applications such as
Electric Power Steering, Battery Switch, SMPS and other
heavy loads.
D
S
S
S
S
S
G
D2Pak 7 Pin
G
D
S
Gate
Drain
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
Symbol
ID @ TC = 25°C
ID @ TC = 100°C
ID @ TC = 25°C
IDM
Parameter
Max.
400
Units
A
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Wire Bond Limited)
280
240
1610
Pulsed Drain Current
PD @TC = 25°C
W
380
Maximum Power Dissipation
Linear Derating Factor
2.5
W/°C
V
VGS
EAS
IAR
± 20
290
Gate-to-Source Voltage
Single Pulse Avalanche Energy (Thermally limited)
mJ
A
Avalanche Current
See Fig. 14, 15, 22a, 22b
Repetitive Avalanche Energy
EAR
mJ
2.0
Peak Diode Recovery
dv/dt
TJ
V/ns
-55 to + 175
Operating Junction and
TSTG
°C
Storage Temperature Range
300
Soldering Temperature, for 10 seconds (1.6mm from case)
Thermal Resistance
Symbol
Parameter
Typ.
–––
Max.
0.40
40
Units
°C/W
RJC
Junction-to-Case
RJA
–––
Junction-to-Ambient (PCB Mount)
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
11/29/11