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AUIRFR2607ZTRL PDF预览

AUIRFR2607ZTRL

更新时间: 2024-11-26 14:32:51
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
11页 663K
描述
Power Field-Effect Transistor, 42A I(D), 75V, 0.022ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, DPAK-3/2

AUIRFR2607ZTRL 技术参数

生命周期:Obsolete包装说明:SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.69其他特性:ULTRA LOW RESISTANCE
雪崩能效等级(Eas):96 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:75 V
最大漏极电流 (ID):42 A最大漏源导通电阻:0.022 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-252AA
JESD-30 代码:R-PSSO-G2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):180 A参考标准:AEC-Q101
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

AUIRFR2607ZTRL 数据手册

 浏览型号AUIRFR2607ZTRL的Datasheet PDF文件第2页浏览型号AUIRFR2607ZTRL的Datasheet PDF文件第3页浏览型号AUIRFR2607ZTRL的Datasheet PDF文件第4页浏览型号AUIRFR2607ZTRL的Datasheet PDF文件第5页浏览型号AUIRFR2607ZTRL的Datasheet PDF文件第6页浏览型号AUIRFR2607ZTRL的Datasheet PDF文件第7页 
AUTOMOTIVE GRADE  
AUIRFR2607Z  
Features  
VDSS  
75V  
Advanced Process Technology  
Ultra Low On-Resistance  
175°C Operating Temperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free, RoHS Compliant  
Automotive Qualified *  
RDS(on)  
typ.  
17.6m  
max.  
22m  
45A  
42A  
ID (Silicon Limited)  
ID (Package Limited)  
D
S
Description  
G
Specifically designed for Automotive applications, this HEXFET®  
Power MOSFET utilizes the latest processing techniques to  
achieve extremely low on-resistance per silicon area. Additional  
features of this design are a 175°C junction operating temperature,  
fast switching speed and improved repetitive avalanche rating .  
These features combine to make this design an extremely efficient  
and reliable device for use in Automotive applications and a wide  
variety of other applications.  
G
D
S
Gate  
Drain  
Source  
Standard Pack  
Form  
Tube  
Base part number  
Package Type  
Orderable Part Number  
Quantity  
75  
3000  
AUIRFR2607Z  
AUIRFR2607ZTRL  
AUIRFR2607Z  
D-Pak  
Tape and Reel Left  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress  
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance  
and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless  
otherwise specified.  
Symbol  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
45  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current   
32  
42  
A
180  
110  
0.72  
PD @TC = 25°C  
Maximum Power Dissipation  
W
W/°C  
V
Linear Derating Factor  
VGS  
EAS  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy (Thermally Limited)   
± 20  
96  
mJ  
EAS (Tested)  
Single Pulse Avalanche Energy Tested Value   
Avalanche Current   
96  
IAR  
See Fig.15,16, 12a, 12b  
A
EAR  
TJ  
Repetitive Avalanche Energy   
mJ  
Operating Junction and  
Storage Temperature Range  
Soldering Temperature, for 10 seconds (1.6mm from case)  
-55 to + 175  
300  
TSTG  
°C  
Thermal Resistance  
Symbol  
Parameter  
Junction-to-Case   
Typ.  
–––  
–––  
–––  
Max.  
1.38  
50  
Units  
RJC  
RJA  
RJA  
Junction-to-Ambient ( PCB Mount)   
Junction-to-Ambient  
°C/W  
110  
HEXFET® is a registered trademark of Infineon.  
*Qualification standards can be found at www.infineon.com  
1
2015-10-12  

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