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AUIRFR2607ZTR PDF预览

AUIRFR2607ZTR

更新时间: 2024-11-26 06:38:47
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
13页 284K
描述
HEXFET® Power MOSFET

AUIRFR2607ZTR 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:ROHS COMPLIANT, PLASTIC, DPAK-3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.16
Is Samacsys:N其他特性:AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
雪崩能效等级(Eas):96 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:75 V
最大漏极电流 (Abs) (ID):45 A最大漏极电流 (ID):42 A
最大漏源导通电阻:0.022 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252AAJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):110 W
最大脉冲漏极电流 (IDM):180 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:MATTE TIN OVER NICKEL端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

AUIRFR2607ZTR 数据手册

 浏览型号AUIRFR2607ZTR的Datasheet PDF文件第2页浏览型号AUIRFR2607ZTR的Datasheet PDF文件第3页浏览型号AUIRFR2607ZTR的Datasheet PDF文件第4页浏览型号AUIRFR2607ZTR的Datasheet PDF文件第5页浏览型号AUIRFR2607ZTR的Datasheet PDF文件第6页浏览型号AUIRFR2607ZTR的Datasheet PDF文件第7页 
PD - 96323  
AUTOMOTIVE MOSFET  
AUIRFR2607Z  
HEXFET® Power MOSFET  
Features  
V(BR)DSS  
75V  
D
S
l
l
l
l
l
l
l
AdvancedProcessTechnology  
RDS(on) typ.  
max.  
UltraLowOn-Resistance  
175°COperatingTemperature  
FastSwitching  
17.6m  
22m  
45A  
G
RepetitiveAvalancheAlloweduptoTjmax  
Lead-Free,RoHSCompliant  
AutomotiveQualified*  
ID (Silicon Limited)  
ID (Package Limited)  
42A  
Description  
D
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniques to achieve extremely low on-resistance per  
siliconarea. Additionalfeaturesofthisdesign area175°C  
junction operating temperature, fast switching speed and  
improved repetitive avalanche rating . These features  
combine to make this design an extremely efficient and  
reliabledeviceforuseinAutomotiveapplicationsandawide  
varietyofotherapplications.  
S
D
G
D-Pak  
AUIRFR2607Z  
G
D
S
Gate  
Drain  
Source  
AbsoluteMaximumRatings  
StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice. These  
arestressratingsonly;andfunctionaloperationofthedeviceattheseoranyotherconditionbeyondthoseindicatedin  
thespecificationsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevice  
reliability.Thethermalresistanceandpowerdissipationratingsaremeasuredunderboardmountedandstillairconditions.  
Ambienttemperature(TA)is25°C, unlessotherwisespecified.  
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited)  
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V (Silicon Limited)  
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Package Limited)  
45  
32  
A
42  
IDM  
180  
Pulsed Drain Current  
PD @TC = 25°C  
110  
Power Dissipation  
W
W/°C  
V
0.72  
Linear Derating Factor  
VGS  
EAS  
± 20  
Gate-to-Source Voltage  
96  
Single Pulse Avalanche Energy (Thermally limited)  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
mJ  
E
AS (Tested )  
96  
IAR  
See Fig.12a, 12b, 15, 16  
A
EAR  
TJ  
Repetitive Avalanche Energy  
Operating Junction and  
mJ  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
°C  
300 (1.6mm from case )  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.38  
50  
Units  
RθJC  
RθJA  
RθJA  
Junction-to-Case  
Junction-to-Ambient (PCB mount)  
Junction-to-Ambient  
°C/W  
110  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
08/24/10  

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