PD - 97542
AUTOMOTIVE GRADE
AUIRF3205Z
AUIRF3205ZS
HEXFET® Power MOSFET
Features
●
●
●
●
●
Advanced Process Technology
UltraLowOn-Resistance
175°COperatingTemperature
Fast Switching
Repetitive Avalanche Allowed up to
Tjmax
D
S
V(BR)DSS
55V
6.5m
RDS(on) max.
Ω
G
ID (Silicon Limited)
ID (Package Limited)
110A
75A
●
●
Lead-Free,RoHSCompliant
Automotive Qualified *
Description
Specifically designed for Automotive applications,
this HEXFET® Power MOSFET utilizes the latest
processing techniques to achieve extremely low on-
resistance per silicon area. Additional features of
this design are a 175°C junction operating tempera-
ture, fast switching speed and improved repetitive
avalanche rating . These features combine to make
this design an extremely efficient and reliable device
for use in Automotive applications and a wide variety
of other applications.
D
D
S
S
D
G
D
G
D2Pak
TO-220AB
AUIRF3205Z
AUIRF3205ZS
G
D
S
Gate
Drain
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings
only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power
dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise
specified.
Parameter
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Max.
110
78
Units
(Silicon Limited)
I
I
I
I
@ T = 25°C
C
D
D
D
@ T = 100°C
C
A
(Package Limited)
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
@ T = 25°C
C
75
440
DM
P
@T = 25°C
C
Power Dissipation
170
1.1
W
W/°C
V
D
Linear Derating Factor
Gate-to-Source Voltage
V
± 20
GS
EAS
180
250
mJ
Single Pulse Avalanche Energy (Thermally Limited)
Single Pulse Avalanche Energy Tested Value
EAS (tested )
Avalanche Current
IAR
See Fig.12a, 12b, 15, 16
A
Repetitive Avalanche Energy
EAR
mJ
T
J
Operating Junction and
-55 to + 175
T
Storage Temperature Range
°C
STG
Soldering Temperature, for 10 seconds (1.6mm from case )
Mounting Torque, 6-32 or M3 screw
300
10 lbf in (1.1N m)
Thermal Resistance
Parameter
Typ.
–––
Max.
0.90
–––
62
Units
°C/W
RθJC
Junction-to-Case
RθCS
RθJA
RθJA
0.50
–––
Case-to-Sink, Flat Greased Surface
Junction-to-Ambient
–––
40
Junction-to-Ambient (PCB Mount)
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
07/23/2010