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AUIRF2805STRR PDF预览

AUIRF2805STRR

更新时间: 2024-11-30 12:53:03
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
14页 281K
描述
Advanced Planar Technology

AUIRF2805STRR 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.17
Is Samacsys:N其他特性:AVALANCHE RATED, HIGH RELIABILITY
雪崩能效等级(Eas):380 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:55 V
最大漏极电流 (Abs) (ID):135 A最大漏极电流 (ID):75 A
最大漏源导通电阻:0.0047 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):200 W
最大脉冲漏极电流 (IDM):700 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

AUIRF2805STRR 数据手册

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PD - 96383A  
AUTOMOTIVE GRADE  
AUIRF2805S  
AUIRF2805L  
HEXFET® Power MOSFET  
Features  
D
S
AdvancedPlanarTechnology  
LowOn-Resistance  
Dynamic dV/dT Rating  
175°COperatingTemperature  
Fast Switching  
V(BR)DSS  
55V  
RDS(on) max.  
ID  
4.7m  
135A  
Ω
G
Fully Avalanche Rated  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
Automotive Qualified *  
Description  
Specifically designed for Automotive applications, this  
Stripe Planar design of HEXFET® Power MOSFETs  
utilizes the latest processing techniques to achieve low  
on-resistancepersiliconarea.Thisbenefitcombinedwith  
the fast switching speed and ruggedized device design  
that HEXFET power MOSFETs are well known for,  
provides the designer with an extremely efficient and  
reliabledeviceforuseinAutomotiveandawidevarietyof  
otherapplications.  
D2Pak  
AUIRF2805S  
TO-262  
AUIRF2805L  
G
Gate  
D
S
Drain  
Source  
Absolute Maximum Ratings  
StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated  
in the specifications is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect  
device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still  
air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
Max.  
135  
96  
Units  
I
I
I
@ T = 25°C  
C
D
D
@ T = 100°C  
A
C
700  
200  
1.3  
DM  
W
W/°C  
V
P
@T = 25°C  
Power Dissipation  
D
C
Linear Derating Factor  
±20  
380  
920  
V
EAS  
Gate-to-Source Voltage  
GS  
Single Pulse Avalanche Energy  
Single Pulse Avalanche Energy Tested value  
Avalanche Current  
mJ  
EAS (Tested)  
IAR  
A
See Fig.12a,12b, 15,16  
EAR  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
mJ  
2.0  
dv/dt  
V/ns  
-55 to + 175  
T
T
J
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
STG  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
0.75  
40  
Units  
RθJC  
RθJA  
Junction-to-Case  
°C/W  
Junction-to-Ambient (PCB mounted)  
–––  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
08/29/11  

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