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ATS-51450R-C2-R0 PDF预览

ATS-51450R-C2-R0

更新时间: 2024-11-07 06:38:39
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描述
Ultra High Performance BGA Cooling

ATS-51450R-C2-R0 数据手册

  
Ultra High Performance BGA Cooling  
Solutions w/ maxiGRIP™ Attachment  
ATS PART # ATS-51450R-C2-R0  
Features & Benefits  
D
C
»
maxiFLOW™ design features a low profile, spread fin  
array that maximizes surface area for more effective  
convection (air) cooling  
»
»
maxiGRIP™ attachment applies steady, even pressure to  
the component and does not require holes in the PCB  
B
A
Meets Telcordia GR-63-Core Office Vibration; ETSI 300  
019 Transportation Vibration; and MIL-STD-810 Shock and  
Unpackaged Drop Testing standards  
»
»
Comes preassembled with high performance thermal  
interface material  
Designed for low profile components from 1.5 to 2.99mm  
ꢁhermal Performance  
*Image above is for illustration purposes only.  
AIR VELOCITy  
THERMAL RESISTANCE  
FT/MIN  
200  
M/S  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
°C/W (UNDUCTED FLOW)  
°C/W (DUCTED FLOW)  
1.2  
1.6  
1.3  
1.1  
1
300  
400  
500  
600  
0.9  
0.8  
0.8  
700  
800  
Product Details  
INTERFACE MATERIAL  
SAINT-GOBAIN C675  
DIMENSION A  
45 mm  
DIMENSION B  
DIMENSION C  
DIMENSION D  
FINISH  
45 mm  
19.5 mm  
76.5 mm  
BLACK- ANODIZED  
Nꢀꢁꢂꢃ:  
1)  
2)  
Dimension C = heat sink height from bottom of the base to the top of the fin field.  
Thermal performance data are provided for reference only. Actual performance may vary  
by application.  
3)  
ATS reserves the right to update or change its products without notice to improve the  
design or performance.  
4)  
5)  
Optional maxiGRIP™ Installation/Removal Tool Set P/N: MGT450  
Contact ATS to learn about custom options available.  
For more information, to find a distributor or to place an order, visit www.qats.com or  
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).  
REV1_0908  

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