Document Number: MDE6IC7120N
Rev. 0, 10/2009
Freescale Semiconductor
Technical Data
RF LDMOS Wideband Integrated
Power Amplifiers
The MDE6IC7120N/GN wideband integrated circuit is designed with
on-chip matching that makes it usable from 728 to 768 MHz. This multi-stage
structure is rated for 26 to 32 Volt operation and covers all typical cellular base
station modulation formats.
MDE6IC7120NR1
MDE6IC7120GNR1
• Typical Doherty Single-Carrier W-CDMA Performance: VDD = 28 Volts,
IDQ1A = IDQ1B = 80 mA, IDQ2A = 550 mA, VG2B = 2.3 Vdc, Pout = 25 Watts
Avg., IQ Magnitude Clipping, Channel Bandwidth = 3.84 MHz, Input Signal
PAR = 7.5 dB @ 0.01% Probability on CCDF.
728-768 MHz, 25 W AVG., 28 V
SINGLE W-CDMA
RF LDMOS WIDEBAND
INTEGRATED POWER AMPLIFIERS
G
PAE
(%)
Output PAR
(dB)
ACPR
(dBc)
ps
Frequency
728 MHz
748 MHz
768 MHz
(dB)
35.0
34.4
33.8
42.0
40.6
39.1
6.2
6.8
6.9
-39.0
-41.3
-37.3
CASE 1866-02
TO-270 WBL-16
PLASTIC
MDE6IC7120NR1
• Capable of Handling 10:1 VSWR, @ 32 Vdc, 748 MHz, 104 Watts CW
Output Power (2 dB Input Overdrive from Rated Pout), Designed for
Enhanced Ruggedness
• Stable into a 5:1 VSWR. All Spurs Below -60 dBc @ 100 mW to
120 Watts CW Pout
• Typical Pout @ 1 dB Compression Point ] 120 Watts CW
CASE 1867-02
TO-270 WBL-16 GULL
PLASTIC
Features
• Production Tested in a Symmetrical Doherty Configuration
• 100% PAR Tested for Guaranteed Output Power Capability
MDE6IC7120GNR1
• Characterized with Series Equivalent Large-Signal Impedance Parameters
and Common Source S-Parameters
• On-Chip Matching (50 Ohm Input, DC Blocked)
• Integrated Quiescent Current Temperature Compensation with Enable/Disable Function (1)
• Integrated ESD Protection
• 225°C Capable Plastic Package
• RoHS Compliant
• In Tape and Reel. R1 Suffix = 500 Units per 44 mm, 13 inch Reel
V
GS1A
(2)
V
GND
RF
1
2
3
CARRIER
RF /V
GS1A
inA
RF
inA
out1 DS2A
16
15
GND
NC
4
5
RF /V
out1 DS2A
V
V
V
6
7
8
9
10
11
12
13
14
GS2A
V
GS2A
Quiescent Current
Temperature Compensation
DS1A
DS1B
(1)
V
DS1A
V
GS2B
NC
RF /V
out2 DS2B
V
DS1B
GS2B
GND
RF
GND
(2)
PEAKING
RF /V
V
inB
RF
inB
out2 DS2B
V
GS1B
(Top View)
V
GS1B
Quiescent Current
Temperature Compensation
(1)
Note: Exposed backside of the package is
the source terminal for the transistors.
Figure 1. Functional Block Diagram
Figure 2. Pin Connections
1. Refer to AN1977, Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family and to AN1987, Quiescent Current Control
for the RF Integrated Circuit Device Family. Go to http://www.freescale.com/rf. Select Documentation/Application Notes - AN1977 or AN1987.
2. Peaking and Carrier orientation is determined by the test fixture design.
© Freescale Semiconductor, Inc., 2009. All rights reserved.
MDE6IC7120NR1 MDE6IC7120GNR1
RF Device Data
Freescale Semiconductor
1