Datasheet > ATA663211

ATA663211

更新时间： 2024-11-06 02:52:55

品牌	Logo	应用领域
美国微芯 - MICROCHIP		/
页数	文件大小	规格书
28页	541K
描述
LIN Transceiver

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ATA663211 数据手册

ATA663211

LIN Transceiver

Features

Description

• ISO 26262 Functional Safety Ready

• Supply Voltage up to 40V

The ATA663211 device is a fully integrated LIN

transceiver designed in compliance with the LIN

specification 2.0, 2.1, 2.2, 2.2A and SAEJ2602-2. It

interfaces the LIN protocol handler and the physical

layer. The device is designed to handle the low-speed

data communication in convenience electronics, for

example, in vehicles. Improved slope control at the LIN

bus ensures data communication up to 20 Kbaud.

Sleep mode guarantees minimal current consumption

even in the case of a floating bus line or a short circuit

on the LIN bus to GND.

• Operating Voltage V_VS= 5V to 28V

• Very Low Supply Current

- Sleep mode: Typically 9 A

- Fail-Safe mode: Typically 80 A

- Normal mode: Typically 250 A

• Fully Compatible with 3.3V and 5V Devices

• LIN Physical Layer according to LIN 2.0, 2.1, 2.2,

2.2A and SAEJ2602-2

Note:

The current LIN standards use the

terminology "Master" and "Slave”.

• Wake-Up Capability through LIN bus (100 s

Dominant)

The LIN standard groups have decided

that the terms "Commander" and

"Responder" will be used in future.

• External Wake Up through WKin pin (100 s Low

Level)

• INH Output to Control an External Voltage

Regulator or to Switch the Commander Pull-Up

Package Types

• Wake-Up Source Recognition

• TXD Time-Out Timer

ATA663211

8-Lead VDFN

• Bus Pin is Overtemperature and Short-Circuit

Protected vs. GND and Battery

RXD

INH

• Advanced EMC and ESD Performance

• Fulfills the OEM “Hardware Requirements for LIN

in Automotive Applications Rev.1.3”

LIN

GND

WKin

TXD

• Interference and Damage Protection according to

ISO7637

• Qualified according to AEC-Q100 and AEC-Q006

ATA663211

8-Lead SOIC

• Package: 8-Lead VDFN, 8-Lead SOIC, with

Wettable Flanks (Moisture Sensitivity Level 1)

RXD

INH

WKin

TXD

LIN

GND

*Includes Exposed Thermal Pad (EP);

see Table 1-4.

 2019-2021 Microchip Technology Inc.

DS20006191D-page 1

12 3 4 5 6 7...28

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