Datasheet > ATA6612C

ATA6612C

更新时间： 2023-12-06 20:03:28

品牌	Logo	应用领域
美国微芯 - MICROCHIP		/
页数	文件大小	规格书
312页	9522K
描述
The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting h

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ATA6612C 数据手册

Absolute Maximum Ratings

Table 2-1. Maximum Ratings of the SiP

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a

stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the

operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended

periods may affect device reliability.

Parameters

Symbol

Min.

Typ.

Max.

Unit

HBM ESD

ANSI/ESD -STM5.1

JESD22 -A114

AEC-Q100 (002)

±2

CDM ESD STM 5.3.1

Corner pins (1, 12, 13, 24, 25, 36, 37, 48)

All other pins

750

500

Machine model ESD AEC-Q100-Rev.F (003)

±100

ESD according to IBEE LIN EMC

Test Spec. 1.0 following IEC 61000-4-2

- Pin VS, LIN, KL_15 (47kΩ/100nF) to GND

- Pin WAKE (33 kΩ serial resistor) to GND

±6

±5

ESD HBM following STM5.1 with 1.5kΩ 100pF

- Pin VS, LIN, KL_15, WAKE to GND

±6

Storage temperature

Operating temperature⁽¹⁾

T_s

–55

–40

+150

+125

°C

T_case

R_thjc

R_thja

Thermal resistance junction to heat slug

Thermal resistance junctiion to ambient

Thermal shutdown of VCC regulator

Thermal shutdown of LIN output

Thermal shutdown hysteresis

K/W

°C

150

165

170

°C

Note:

1. T_casemeans the temperature of the heat slug (backside). It is mandatory that this backside temperature is

≤ 125°C in the application.

ATA6612C/ATA6613C [DATASHEET]

9111L–AUTO–11/14

1 2 3 456 7 8...312

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