是否Rohs认证: | 符合 | 生命周期: | Transferred |
零件包装代码: | BGA | 包装说明: | VFBGA, BGA8,2X4,40/20 |
针数: | 8 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
风险等级: | 5.83 | 最大时钟频率 (fCLK): | 1 MHz |
数据保留时间-最小值: | 100 | 耐久性: | 1000000 Write/Erase Cycles |
I2C控制字节: | 1010DDDR | JESD-30 代码: | R-PBGA-B8 |
JESD-609代码: | e3 | 长度: | 2 mm |
内存密度: | 2048 bit | 内存集成电路类型: | EEPROM |
内存宽度: | 8 | 功能数量: | 1 |
端子数量: | 8 | 字数: | 256 words |
字数代码: | 256 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 256X8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装等效代码: | BGA8,2X4,40/20 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
并行/串行: | SERIAL | 电源: | 1.8/5 V |
认证状态: | Not Qualified | 座面最大高度: | 0.85 mm |
串行总线类型: | I2C | 最大待机电流: | 0.000001 A |
子类别: | EEPROMs | 最大压摆率: | 0.003 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | MATTE TIN | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
宽度: | 1.5 mm | 最长写入周期时间 (tWC): | 5 ms |
写保护: | HARDWARE |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
AT24C02BU3-10UU-1.8 | ATMEL |
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