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AS7C3364PFD32B-200TQI PDF预览

AS7C3364PFD32B-200TQI

更新时间: 2024-11-24 23:00:35
品牌 Logo 应用领域
ALSC 内存集成电路静态存储器
页数 文件大小 规格书
19页 549K
描述
3.3V 64K X 32/36 pipeline burst synchronous SRAM

AS7C3364PFD32B-200TQI 数据手册

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February 2005  
AS7C3364PFD32B  
AS7C3364PFD36B  
®
3.3V 64K X 32/36 pipeline burst synchronous SRAM  
Features  
• Linear or interleaved burst control  
• Organization: 65,536 words × 32 or 36 bits  
• Fast clock speeds to 200 MHz  
• Fast clock to data access: 3.0/3.5/4.0 ns  
• Fast OE access time: 3.0/3.5/4.0 ns  
• Fully synchronous register-to-register operation  
• Double-cycle deselect  
• Individual byte write and global write  
• Snooze mode for reduced power-standby  
• Common data inputs and data outputs  
• Multiple chip enables for easy expansion  
• 3.3V core power supply  
• 2.5V or 3.3V I/O operation with separate V  
DDQ  
• Asynchronous output enable control  
• Available in 100-pin TQFP package  
Logic block diagram  
LBO  
CLK  
ADV  
ADSC  
ADSP  
CLK  
CE  
CLR  
Burst logic  
64K × 32/36  
Memory  
array  
16  
14  
16  
16  
D
CE  
CLK  
Q
A[15:0]  
Address  
register  
36/32  
36/32  
GWE  
BWE  
d
D
Q
Q
Q
Q
DQ  
d
Byte write  
BW  
registers  
CLK  
D
DQ  
c
BW  
c
Byte write  
registers  
CLK  
D
DQ  
b
BW  
b
Byte write  
registers  
CLK  
D
DQ  
a
4
BW  
a
Byte write  
registers  
CLK  
D
CE0  
CE1  
CE2  
OE  
Output  
registers  
CLK  
Q
Q
Input  
registers  
CLK  
Enable  
register  
CE  
CLK  
D
Enable  
delay  
register  
CLK  
Power  
down  
ZZ  
36/32  
DQ [a:d]  
OE  
Selection guide  
–200  
–166  
–133  
7.5  
133  
4
Units  
Minimum cycle time  
5
6
ns  
MHz  
ns  
Maximum clock frequency  
Maximum clock access time  
Maximum operating current  
Maximum standby current  
200  
3.0  
375  
130  
30  
166  
3.5  
350  
100  
30  
325  
90  
mA  
mA  
mA  
Maximum CMOS standby current (DC)  
30  
1/31/05; v.1.1  
Alliance Semiconductor  
P. 1 of 19  
Copyright © Alliance Semiconductor. All rights reserved.  

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