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AS7C251MNTF36A-10TQCN PDF预览

AS7C251MNTF36A-10TQCN

更新时间: 2024-11-27 20:30:23
品牌 Logo 应用领域
美国芯成 - ISSI 静态存储器内存集成电路
页数 文件大小 规格书
18页 414K
描述
ZBT SRAM, 1MX36, 10ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100

AS7C251MNTF36A-10TQCN 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFP
包装说明:LQFP,针数:100
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.53
Is Samacsys:N最长访问时间:10 ns
其他特性:FLOW-THROUGH ARCHITECTURE; LATE WRITEJESD-30 代码:R-PQFP-G100
JESD-609代码:e3长度:20 mm
内存密度:37748736 bit内存集成电路类型:ZBT SRAM
内存宽度:36功能数量:1
端子数量:100字数:1048576 words
字数代码:1000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:1MX36封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):245认证状态:Not Qualified
座面最大高度:1.6 mm最大供电电压 (Vsup):2.625 V
最小供电电压 (Vsup):2.375 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:MATTE TIN
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:14 mmBase Number Matches:1

AS7C251MNTF36A-10TQCN 数据手册

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December 2004  
AS7C251MNTF32A  
AS7C251MNTF36A  
®
2.5V 1M × 32/36 Flowthrough SRAM with NTDTM  
Features  
• Byte write enables  
• Clock enable for operation hold  
• Multiple chip enables for easy expansion  
• 2.5V core power supply  
• Self-timed write cycles  
• Organization: 1,048,576 words × 32 or 36 bits  
• NTD architecture for efficient bus operation  
• Fast clock to data access: 7.5/8.5/10 ns  
• Fast OE access time: 3.5/4.0 ns  
• Fully synchronous operation  
• Flow-through mode  
• Asynchronous output enable control  
• Available in 100-pin TQFP package  
• Interleaved or linear burst modes  
• Snooze mode for standby operation  
Logic block diagram  
20  
20  
A[19:0]  
Q
D
Address  
register  
Burst logic  
CLK  
D
Q
CE0  
CE1  
CE2  
Write delay  
addr. registers  
CLK  
20  
R/W  
BWa  
Control  
logic  
CLK  
BWb  
BWc  
BWd  
ADV / LD  
LBO  
1M x 32/36  
SRAM  
ZZ  
CLK  
Array  
32/36  
32/36  
DQ[a,b,c,d]  
Data  
Input  
Register  
D
Q
32/36  
32/36  
CLK  
32/36  
CLK  
CEN  
Output  
Buffer  
OE  
32/36  
OE  
DQ[a,b,c,d]  
Selection guide  
-75  
8.5  
7.5  
325  
140  
90  
-85  
10  
-10  
12  
Units  
ns  
Minimum cycle time  
Maximum clock access time  
Maximum operating current  
Maximum standby current  
8.5  
300  
130  
90  
10  
ns  
275  
130  
90  
mA  
mA  
mA  
Maximum CMOS standby current (DC)  
12/23/04, v 1.1  
Alliance Semiconductor  
P. 1 of 18  
Copyright © Alliance Semiconductor. All rights reserved.  

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