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AS4C16M16D1-5BCN PDF预览

AS4C16M16D1-5BCN

更新时间: 2024-09-17 01:04:11
品牌 Logo 应用领域
ALSC 时钟动态存储器内存集成电路
页数 文件大小 规格书
67页 2026K
描述
Fully synchronous operation

AS4C16M16D1-5BCN 数据手册

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AS4C16M16D1  
16M x 16 bit DDR Synchronous DRAM (SDRAM)  
Alliance Memory Confidential  
Advanced (Rev. 1.1, Sep. /2011)  
Overview  
Features  
The AS4C16M16D1 SDRAM is a high-speed CMOS  
double data rate synchronous DRAM containing 256 Mbits.  
It is internally configured as a quad 4M x 16 DRAM with a  
synchronous interface (all signals are registered on the  
positive edge of the clock signal, CK). Data outputs occur  
Fast clock rate: 200MHz  
Differential Clock CK &  
CK  
Bi-directional DQS  
CK  
DLL enable/disable by EMRS  
Fully synchronous operation  
Internal pipeline architecture  
Four internal banks, 4M x 16-bit for each bank  
Programmable Mode and Extended Mode registers  
- CAS Latency: 2, 2.5, 3  
at both rising edges of CK and  
.d Read and write  
accesses to the SDRAM are burst oriented; accesses start  
at a selected location and continue for a programmed  
number of locations in a programmed sequence. Accesses  
begin with the registration of a BankActivate command  
which is then followed by a Read or Write command. The  
AS4C16M16D1 provides programmable Read or Write  
burst lengths of 2, 4, or 8. An auto precharge function may  
be enabled to provide a self-timed row precharge that is  
initiated at the end of the burst sequence. The refresh  
functions, either Auto or Self Refresh are easy to use. In  
- Burst length: 2, 4, 8  
- Burst Type: Sequential & Interleaved  
Individual byte-write mask control  
DM Write Latency = 0  
Auto Refresh and Self Refresh  
8192 refresh cycles / 64ms  
Operating temperature range  
- Commercial (0 ~ 70°C)  
- Industrial (-40 ~ 85°C)  
addition, AS4C16M16D1 features  
programmable DLL  
option. By having a programmable mode register and  
extended mode register, the system can choose the most  
suitable modes to maximize its performance. These  
devices are well suited for applications requiring high  
memory band-width, result in a device particularly well  
suited to high performance main memory and graphics  
applications.  
Precharge & active power down  
Power supplies: V  
V
= 2.5V 0.2V  
DD & DDQ  
Interface: SSTL_2 I/O Interface  
Package: 66 Pin TSOP II, 0.65mm pin pitch  
- Pb free and Halogen free  
Package: 60-Ball, 8x13x1.2 mm (max) TFBGA  
- Pb free and Halogen Free  
Table 1.Ordering Information  
Temperature Temp Range  
Part Number  
Clock  
Data Rate  
Package  
Commercial  
Industrial  
0 ~ 70°C  
-40 ~ 85°C  
0 ~ 70°C  
AS4C16M16D1-5TCN 200MHz 400Mbps/pin 66pin TSOPII  
AS4C16M16D1-5TIN 200MHz 400Mbps/pin 66pin TSOPII  
AS4C16M16D1-5BCN 200MHz 400Mbps/pin 60ball TFBGA  
AS4C16M16D1-5BIN 200MHz 400Mbps/pin 60ball TFBGA  
Commercial  
Industrial  
-40 ~ 85°C  
T: indicates TSOP II package  
B: indicates TFBGA package  
C: indicates Commercial temp.  
I: indicates Industrial temp.  
N: indicates lead free ROHS  
Alliance Memory, Inc.  
551 Taylor Way, San Carlos, CA 94070  
TEL: (650) 610-6800  
FAX: (650) 620-9211  
Alliance Memory, Inc. reserves the right to change products or specification without notice.  

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