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ARF521 PDF预览

ARF521

更新时间: 2024-11-19 08:34:23
品牌 Logo 应用领域
美高森美 - MICROSEMI 晶体射频场效应晶体管放大器局域网
页数 文件大小 规格书
4页 130K
描述
RF POWER MOSFET N-CHANNEL ENHANCEMENT MODE

ARF521 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:CERAMIC, SOE, 4 PIN
针数:4Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.69
Is Samacsys:N其他特性:HIGH RELIABILITY
配置:SINGLE最小漏源击穿电压:500 V
最大漏极电流 (ID):10 AFET 技术:METAL-OXIDE SEMICONDUCTOR
最高频带:VERY HIGH FREQUENCY BANDJESD-30 代码:O-CRFM-F4
JESD-609代码:e0元件数量:1
端子数量:4工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:ROUND封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
认证状态:Not Qualified表面贴装:YES
端子面层:TIN LEAD端子形式:FLAT
端子位置:RADIAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
Base Number Matches:1

ARF521 数据手册

 浏览型号ARF521的Datasheet PDF文件第2页浏览型号ARF521的Datasheet PDF文件第3页浏览型号ARF521的Datasheet PDF文件第4页 
ARF521  
165V, 150W, 150MHz  
RF POWER MOSFET  
N-CHANNEL ENHANCEMENT MODE  
The ARF521 is an RF power transistor designed for high voltage operation in  
broadband HF, narrow band ISM and MRI power ampliers up to 150MHz.  
• High Voltage Breakdown and Large SOA  
• Specied 125 Volt, 81MHz Characteristics:  
Output Power = 150 Watts.  
Gain = 13dB (Class AB)  
for Superior Ruggedness.  
• Industry Standard Package  
• Low Vth Thermal Coefcient  
Efciency = 50%  
Maximum Ratings  
All Ratings: TC =25°C unless otherwise specied  
Symbol  
Parameter  
ARF521  
Unit  
VDSS  
Drain-Source Voltage  
500  
V
ID  
VGS  
Continuous Drain Current @ TC = 25°C  
Gate-Source Voltage  
10  
A
±30  
V
PD  
Total Device Dissipation @ TC = 25°C  
Operating and Storage Junction Temperature Range  
Lead Temperature: 0.063” from Case for 10 Sec.  
250  
W
TJ, TSTG  
TL  
-55 to 175  
300  
°C  
Static Electrical Characteristics  
Symbol  
Parameter  
Min  
Typ  
Max  
Unit  
V
V(BR)DSS  
Drain-Source Breakdown Voltage (VGS = 0V, ID = 250 μA)  
Drain-Source On-State Resistance 1 (ID(ON) = 5A, VGS = 10V)  
Zero Gate Voltage Drain Current (VDS = VDSS, VGS = 0V)  
Zero Gate Voltage Drain Current (VDS = 50V, VGS = 0, TC = 125°C)  
Gate-Source Leakage Current (VDS = ±30V, VDS = 0V)  
Forward Transconductance (VDS = 15V, ID = 5A)  
Gate Threshold Voltage (VDS = VGS, ID = 200mA)  
500  
VDS(ON)  
0.56  
0.8  
25  
Ω
IDSS  
μA  
250  
±100  
IGSS  
gfs  
nA  
3
2
3.6  
mhos  
Volts  
VGS(TH)  
4
Thermal Characteristics  
Symbol  
Characteristic  
Min  
Typ  
Max  
Unit  
Junction to Case Thermal Resistance  
0.60  
Rθ  
JC  
°C/W  
Case to Sink (Use High Efciency Thermal Joint Compound and Planar Heat Sink Surface.)  
0.1  
Rθ  
CS  
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
Microsemi Website - http://www.microsemi.com  

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