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ARF477FLG PDF预览

ARF477FLG

更新时间: 2024-11-19 13:05:39
品牌 Logo 应用领域
美高森美 - MICROSEMI 晶体射频场效应晶体管放大器局域网
页数 文件大小 规格书
4页 146K
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ARF477FLG 数据手册

 浏览型号ARF477FLG的Datasheet PDF文件第2页浏览型号ARF477FLG的Datasheet PDF文件第3页浏览型号ARF477FLG的Datasheet PDF文件第4页 
Common Source  
Push-Pull Pair  
ARF477FL  
D
G
S
S
S
S
ARF477FL  
G
D
RF POWER MOSFET  
N-CHANNEL PUSH - PULL PAIR  
165V 400W 100MHz  
The ARF477FL is a matched pair of RF power transistors in a common source conguration. It is designed for high  
voltage push-pull or parallel operation in narrow band ISM and MRI power ampliers up to 100 MHz.  
High Performance Push-Pull RF Package.  
Specied 150 Volt, 65 MHz Characteristics:  
High Voltage Breakdown and Large SOA  
Output Power = 400 Watts  
Gain = 15dB (Class AB)  
Efciency = 50% min  
for Superior Ruggedness.  
Low Thermal Resistance.  
RoHS Compliant  
MAXIMUM RATINGS  
All Ratings: T = 25°C unless otherwise specied.  
C
Symbol  
Parameter  
Ratings  
500  
Unit  
VDSS  
Drain-Source Voltage  
V
VDGO  
ID  
Drain-Gate Voltage  
500  
Continuous Drain Current @ TC = 25°C (each device)  
Gate-Source Voltage  
15  
A
V
VGS  
±30  
PD  
Total Power Dissipation @ TC = 25°C  
Operating and Storage Junction Temperature Range  
Lead Temperature: 0.063” from Case for 10 Sec.  
750  
W
TJ, TSTG  
TL  
-55 to 175  
300  
°C  
Static Electrical Characteristics  
Symbol  
Parameter  
Min  
Typ  
Max  
Unit  
BVDSS  
Drain-Source Breakdown Voltage (VGS = 0V, ID = 250 μA)  
On State Drain Voltage 1 (ID(ON) = 7.5A, VGS = 10V)  
Zero Gate Voltage Drain Current (VDS = VDSS, VGS = 0V)  
Zero Gate Voltage Drain Current (VDS = 50VDSS, VGS = 0, TC = 125°C)  
Gate-Source Leakage Current (VGS = ±30V, VDS = 0V)  
Forward Transconductance (VDS = 15V, ID = 7.5A)  
500  
V
VDS(ON)  
2.9  
4
25  
IDSS  
μA  
250  
±100  
8
IGSS  
gfs  
nA  
3.5  
0.9  
3
5.6  
mhos  
gfs1/gfa2  
VGS(TH)  
VGS(TH)  
Forward Transconductance Match Ratio (VDS = 15V, ID = 5A)  
Gate Threshold Voltage (VDS = VGS, ID = 50mA)  
1.1  
5
Gate Threshold Voltage Match (VDS = VGS, ID = 50mA)  
0.2  
Volts  
Thermal Characteristics  
Symbol  
Parameter  
Min  
Typ  
0.18  
0.30  
Max  
0.2  
Unit  
RθJC  
Junction to Case  
°C/W  
RθJHS  
Junction to Sink (High Efciency Thermal Joint Compound and Planar Heat Sink Surface.)  
0.32  
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
Microsemi Website - http://www.microsemi.com  

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