生命周期: | Transferred | 包装说明: | FLANGE MOUNT, R-XUFM-X21 |
Reach Compliance Code: | unknown | 风险等级: | 5.68 |
Is Samacsys: | N | 外壳连接: | ISOLATED |
最大集电极电流 (IC): | 70 A | 集电极-发射极最大电压: | 1700 V |
配置: | 3 BANKS, COMMON EMITTER, 2 ELEMENTS WITH BUILT-IN DIODE | JESD-30 代码: | R-XUFM-X21 |
元件数量: | 6 | 端子数量: | 21 |
封装主体材料: | UNSPECIFIED | 封装形状: | RECTANGULAR |
封装形式: | FLANGE MOUNT | 极性/信道类型: | N-CHANNEL |
认证状态: | Not Qualified | 表面贴装: | NO |
端子形式: | UNSPECIFIED | 端子位置: | UPPER |
晶体管应用: | POWER CONTROL | 晶体管元件材料: | SILICON |
标称断开时间 (toff): | 930 ns | 标称接通时间 (ton): | 310 ns |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
APTGT50TDU170PG | MICROSEMI |
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Triple Dual Common Source Trench + Field Stop IGBT Power Module | |
APTGT50TDU170PG-Module | MICROCHIP |
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Configuration: Triple Dual common sourceVCES (V): 1700VCESat (V): 2Current (A) Tc=80C: 50S | |
APTGT50TDU60P | ADPOW |
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Triple Dual Common Source Trench + Field Stop IGBT Power Module | |
APTGT50TDU60PG | MICROSEMI |
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Triple Dual Common Source Trench + Field Stop IGBT Power Module | |
APTGT50TDU60PG-Module | MICROCHIP |
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Configuration: Triple Dual common sourceVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 50 | |
APTGT50TL601G | MICROSEMI |
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Three level inverter Trench + Field Stop IGBT Power Module | |
APTGT50TL601G-Module | MICROCHIP |
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Configuration: Three level inverterVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 50Silic | |
APTGT50TL60T3G | MICROSEMI |
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Three level inverter Trench + Field Stop IGBT Power Module | |
APTGT50TL60T3G-Module | MICROCHIP |
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Configuration: Three level inverterVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 50Silic | |
APTGT50X120BTP3 | ADPOW |
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Input rectifier bridge + Brake + 3 Phase Bridge Trench IGBT Power Module |