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APT80GP60JD3 PDF预览

APT80GP60JD3

更新时间: 2024-09-15 15:41:23
品牌 Logo 应用领域
美高森美 - MICROSEMI 局域网功率控制晶体管
页数 文件大小 规格书
2页 523K
描述
Insulated Gate Bipolar Transistor, 68A I(C), 600V V(BR)CES, N-Channel, ISOTOP-4

APT80GP60JD3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:ISOTOP
包装说明:FLANGE MOUNT, R-PUFM-X4针数:4
Reach Compliance Code:unknown风险等级:5.62
外壳连接:ISOLATED最大集电极电流 (IC):68 A
集电极-发射极最大电压:600 V配置:SINGLE WITH BUILT-IN DIODE
JESD-30 代码:R-PUFM-X4元件数量:1
端子数量:4封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
认证状态:Not Qualified表面贴装:NO
端子形式:UNSPECIFIED端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICONBase Number Matches:1

APT80GP60JD3 数据手册

 浏览型号APT80GP60JD3的Datasheet PDF文件第2页 
Product Profile  
Advanced Power Technology  
New Power MOS 7® IGBTs for SMPS Applications  
600 Volt Size 6 - APT40GP60B2D1  
Product Description  
IGBT products offered by APT utilize both NPT and PT technologies to cover  
the widest range of applications and design requirements. They can be used as  
a cost effective alternative to MOSFETs in many applications with high efficiency,  
improved power density, and lower cost. Recently, APT has announced a new  
generation of 600 and 1200 volt PT-Type IGBTs utilizing its advanced proprietary  
Power MOS 7® Technology. The 600 volt IGBTs are designed to replace 500 and  
600 volt MOSFETs and the 1200 volt IGBTs are designed to replace 1000 and  
1200 volt MOSFETs in switch mode power supply (SMPS), power factor correc-  
tion (PFC), and other high-power applications. The gate-drive voltage require-  
ment is similar to a MOSFET. This allows larger die size power MOSFETs, or  
multiple MOSFETs in parallel to be replaced with just one power MOS 7® IGBT.  
This new generation technology enables operation up to 150 kHz without current  
de-rating. Products range from approximately 10 to 100 amps in TO-220, TO-  
TJ=125OC  
TC=75OC  
D=50%  
VCE=400V  
RG=5W  
I
C Collector Current (A)  
ä
ä
247, T-MAX , TO-264, 264 MAX , and Isotop® packages.  
1200 Volt Size 6 - APT35GP120B2D2  
Higher Threshold Voltage and Re-  
duced “Miller Capacitance” - this pro-  
vides for increased noise and spurious  
turn-on immunity and eliminates the  
need for a negative gate voltage for  
turn-off. This eliminates the need for an  
auxiliary power supply and simplifies the  
use of gate driver ICs.  
TJ=125OC  
TC=75OC  
D=50%  
Low Forward Voltage - conduction  
losses are dramatically lower, especially  
at high temperatures.  
VCE=800V  
RG=5W  
Low Gate Charge – this reduces gate  
drive power losses and enables fast  
switching.  
I
C Collector Current (A)  
Hermetic and Hi-Rel  
Features and Benefits  
Low Thermal Resistance – maximiz-  
ing power dissipation capabilities.  
APT is ISO9001 registered, MIL-PRF-  
19500 certified, and can offer TX, TXV,  
and space level processing. Custom test-  
ing and screening as well as plastic up-  
screening is also available.  
Metal Gate - these IGBTs utilize a pro-  
prietary planar stripe metal gate design  
providing internal chip gate resistance one  
to two orders of magnitude lower than  
comparable industry standard polysilicon  
gate devices. This enables very uniform  
and fast switching across the entire chip  
with uniform heat distribution. The metal  
gate minimizes chip gate resistance varia-  
tion from batch to batch providing the user  
with more consistent switching perfor-  
mance. In addition, the low chip gate re-  
sistance allows the designer maximum  
range of switching speed and increases  
the immunity to dv/dt induced turn-on.  
Combis - Power MOS 7® IGBTs are  
available co-packaged with a fast-recov-  
ery, antiparallel diode optimized for low  
reverse recovery charge, further en-  
hancing performance in power switch-  
ing applications. Co-packaging the  
Power MOS 7® IGBTs with these rectifi-  
ers reduces EMI, switching losses, and  
conduction losses, while reducing com-  
ponent count and cost.  
Power Modules  
Products cover a wide range of power  
and complexity.  
Low Switching Energies – this enables  
very low inductive switching losses. In  
combination with the low conduction  
losses and the low thermal resistance,  
new levels of high frequency capability  
for a given current is achieved.  
Die Products - are available.  
Lower Cost  
Alternative  
to MOSFETS  
www.advancedpower.com  
Nasdaq: APTI  
Data sheets now include a graph of fre-  
quency vs. current for an IGBT Combi.  
This graph comprehends both conduc-  
tion and switching losses and allows the  
designer to properly select the best de-  
vice for the application. Examples are  
shown in the following graphs:  
High Current Density – the IGBT ad-  
vantage in current density over MOSFETs  
facilitates higher output power, provides  
for smaller and lower cost components,  
and allows for smaller and higher power  
density designs. The die size for the IGBT  
is often 1 or 2 die sizes smaller than a  
MOSFET solution.  
Switching Power (541) 382-8028 USA  
Power Modules  
RF Power  
33 337 92 1515 France  
(408) 986-8031 USA  

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