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APT80GA90B PDF预览

APT80GA90B

更新时间: 2024-11-21 06:37:27
品牌 Logo 应用领域
美高森美 - MICROSEMI 晶体晶体管功率控制瞄准线双极性晶体管局域网
页数 文件大小 规格书
6页 215K
描述
High Speed PT IGBT

APT80GA90B 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:TO-247包装说明:ROHS COMPLIANT PACKAGE-3
针数:3Reach Compliance Code:compliant
风险等级:2.18其他特性:LOW CONDUCTION LOSS
外壳连接:COLLECTOR最大集电极电流 (IC):145 A
集电极-发射极最大电压:900 V配置:SINGLE
门极发射器阈值电压最大值:6 V门极-发射极最大电压:30 V
JEDEC-95代码:TO-247JESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):625 W
认证状态:Not Qualified子类别:Insulated Gate BIP Transistors
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):320 ns
标称接通时间 (ton):49 nsBase Number Matches:1

APT80GA90B 数据手册

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APT80GA90B  
APT80GA90S  
900V  
High Speed PT IGBT  
POWER MOS 8® is a high speed Punch-Through switch-mode IGBT. Low Eoff is achieved  
APT80GA90S  
through leading technology silicon design and lifetime control processes. A reduced Eoff  
-
D3PAK  
VCE(ON) tradeoff results in superior efciency compared to other IGBT technologies. Low  
gate charge and a greatly reduced ratio of Cres/Cies provide excellent noise immunity, short  
delay times and simple gate drive. The intrinsic chip gate resistance and capacitance of the  
poly-silicone gate structure help control di/dt during switching, resulting in low EMI, even  
when switching at high frequency.  
APT80GA90B  
Single die IGBT  
FEATURES  
TYPICAL APPLICATIONS  
• Fast switching with low EMI  
• Very Low Eoff for maximum efciency  
• Ultra low Cres for improved noise immunity  
• Low conduction loss  
• ZVS phase shifted and other full bridge  
• Half bridge  
• High power PFC boost  
• Welding  
• Low gate charge  
• UPS, solar, and other inverters  
• High frequency, high efciency industrial  
• Increased intrinsic gate resistance for low EMI  
• RoHS compliant  
Absolute Maximum Ratings  
Symbol Parameter  
Ratings  
Unit  
Collector Emitter Voltage  
900  
V
Vces  
IC1  
Continuous Collector Current @ TC = 25°C  
Continuous Collector Current @ TC = 100°C  
Pulsed Collector Current 1  
145  
80  
A
IC2  
ICM  
239  
VGE  
Gate-Emitter Voltage 2  
±30  
V
PD  
Total Power Dissipation @ TC = 25°C  
Switching Safe Operating Area @ TJ = 150°C  
Operating and Storage Junction Temperature Range  
625  
W
SSOA  
TJ, TSTG  
TL  
239A @ 900V  
-55 to 150  
°C  
Lead Temperature for Soldering: 0.063" from Case for 10 Seconds  
300  
Static Characteristics  
Symbol Parameter  
T = 25°C unless otherwise specied  
J
Test Conditions  
Min  
Typ  
Max  
Unit  
VBR(CES)  
Collector-Emitter Breakdown Voltage  
VGE = 0V, IC = 1.0mA  
900  
TJ = 25°C  
TJ = 125°C  
2.5  
2.2  
4.5  
3.1  
VGE = 15V,  
IC = 47A  
V
VCE(on)  
VGE(th)  
ICES  
Collector-Emitter On Voltage  
Gate Emitter Threshold Voltage  
Zero Gate Voltage Collector Current  
Gate-Emitter Leakage Current  
VGE =VCE , IC = 1mA  
3
6
TJ = 25°C  
250  
VCE = 900V,  
μA  
V
GE = 0V  
TJ = 125°C  
1000  
±100  
IGES  
VGS = ±30V  
nA  
Thermal and Mechanical Characteristics  
Symbol Characteristic  
Min  
Typ  
-
Max  
0.2  
-
Unit  
°C/W  
g
RθJC  
WT  
Junction to Case Thermal Resistance  
Package Weight  
-
-
5.9  
Torque  
Mounting Torque (TO-247 Package), 4-40 or M3 screw  
in·lbf  
10  
Microsemi Website - http://www.microsemi.com  

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