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APT80GA60LD40 PDF预览

APT80GA60LD40

更新时间: 2024-09-15 06:37:27
品牌 Logo 应用领域
美高森美 - MICROSEMI 双极性晶体管
页数 文件大小 规格书
9页 243K
描述
High Speed PT IGBT

APT80GA60LD40 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TO-264AA
包装说明:ROHS COMPLIANT, TO-264, 3 PIN针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:2.24其他特性:LOW CONDUCTION LOSS
外壳连接:COLLECTOR最大集电极电流 (IC):143 A
集电极-发射极最大电压:600 V配置:SINGLE WITH BUILT-IN DIODE
JEDEC-95代码:TO-264AAJESD-30 代码:R-PSFM-T3
JESD-609代码:e1元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL认证状态:Not Qualified
表面贴装:NO端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):326 ns
标称接通时间 (ton):52 nsBase Number Matches:1

APT80GA60LD40 数据手册

 浏览型号APT80GA60LD40的Datasheet PDF文件第2页浏览型号APT80GA60LD40的Datasheet PDF文件第3页浏览型号APT80GA60LD40的Datasheet PDF文件第4页浏览型号APT80GA60LD40的Datasheet PDF文件第5页浏览型号APT80GA60LD40的Datasheet PDF文件第6页浏览型号APT80GA60LD40的Datasheet PDF文件第7页 
APT80GA60LD40  
600V  
High Speed PT IGBT  
POWER MOS 8® is a high speed Punch-Through switch-mode IGBT. Low Eoff is achieved  
through leading technology silicon design and lifetime control processes. A reduced Eoff  
-
VCE(ON) tradeoff results in superior efciency compared to other IGBT technologies. Low  
gate charge and a greatly reduced ratio of Cres/Cies provide excellent noise immunity, short  
delay times and simple gate drive. The intrinsic chip gate resistance and capacitance of the  
poly-silicone gate structure help control di/dt during switching, resulting in low EMI, even  
when switching at high frequency.  
APT80GA60LD40  
Combi (IGBT and Diode)  
FEATURES  
TYPICAL APPLICATIONS  
• Fast switching with low EMI  
• Very Low Eoff for maximum efciency  
• Ultra low Cres for improved noise immunity  
• Low conduction loss  
• ZVS phase shifted and other full bridge  
• Half bridge  
• High power PFC boost  
• Welding  
• Low gate charge  
• UPS, solar, and other inverters  
• High frequency, high efciency industrial  
• Increased intrinsic gate resistance for low EMI  
• RoHS compliant  
Absolute Maximum Ratings  
Symbol Parameter  
Ratings  
Unit  
Collector Emitter Voltage  
600  
V
Vces  
IC1  
Continuous Collector Current @ TC = 25°C  
Continuous Collector Current @ TC = 100°C  
Pulsed Collector Current 1  
143  
80  
A
IC2  
ICM  
240  
VGE  
Gate-Emitter Voltage 2  
±30  
V
PD  
Total Power Dissipation @ TC = 25°C  
Switching Safe Operating Area @ TJ = 150°C  
Operating and Storage Junction Temperature Range  
625  
W
SSOA  
TJ, TSTG  
TL  
240A @ 600V  
-55 to 150  
°C  
Lead Temperature for Soldering: 0.063" from Case for 10 Seconds  
300  
Static Characteristics  
Symbol Parameter  
T = 25°C unless otherwise specied  
J
Test Conditions  
Min  
Typ  
Max  
Unit  
VBR(CES)  
Collector-Emitter Breakdown Voltage  
VGE = 0V, IC = 1.0mA  
600  
TJ = 25°C  
TJ = 125°C  
2.0  
1.9  
4.5  
2.5  
VGE = 15V,  
IC = 47A  
V
VCE(on)  
VGE(th)  
ICES  
Collector-Emitter On Voltage  
Gate Emitter Threshold Voltage  
Zero Gate Voltage Collector Current  
Gate-Emitter Leakage Current  
VGE =VCE , IC = 1mA  
3
6
TJ = 25°C  
275  
VCE = 600V,  
VGE = 0V  
μA  
TJ = 125°C  
3000  
±100  
IGES  
VGS = ±30V  
nA  
Microsemi Website - http://www.microsemi.com  

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