Datasheet > APT27GA90SD15

APT27GA90SD15

更新时间： 2024-09-25 06:37:27

品牌	Logo	应用领域
美高森美 - MICROSEMI		双极性晶体管
页数	文件大小	规格书
9页	255K
描述
High Speed PT IGBT

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中文翻译

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技术参数
数据手册

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APT27GA90SD15 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
包装说明：	,	Reach Compliance Code：	compliant
风险等级：	5.73	最大集电极电流 (IC)：	48 A
集电极-发射极最大电压：	900 V	门极发射器阈值电压最大值：	6 V
门极-发射极最大电压：	30 V	最高工作温度：	150 °C
极性/信道类型：	N-CHANNEL	最大功率耗散 (Abs)：	223 W
子类别：	Insulated Gate BIP Transistors	表面贴装：	YES
Base Number Matches：	1

APT27GA90SD15 数据手册

APT27GA90BD15

APT27GA90SD15

900V

High Speed PT IGBT

POWER MOS 8^®is a high speed Punch-Through switch-mode IGBT. Low E_offis achieved

(B)

D³PAK

through leading technology silicon design and lifetime control processes. A reduced E_off

(S)

V_CE(ON)tradeoff results in superior efﬁciency compared to other IGBT technologies. Low

gate charge and a greatly reduced ratio of C_res/C_iesprovide excellent noise immunity, short

delay times and simple gate drive. The intrinsic chip gate resistance and capacitance of the

poly-silicone gate structure help control di/dt during switching, resulting in low EMI, even

when switching at high frequency.

Combi (IGBT and Diode)

FEATURES

TYPICAL APPLICATIONS

• Fast switching with low EMI

• Very Low E_offfor maximum efﬁciency

• Ultra low C_resfor improved noise immunity

• Low conduction loss

• ZVS phase shifted and other full bridge

• Half bridge

• High power PFC boost

• Welding

• Low gate charge

• UPS, solar, and other inverters

• High frequency, high efﬁciency industrial

• Increased intrinsic gate resistance for low EMI

• RoHS compliant

Absolute Maximum Ratings

Symbol Parameter

Ratings

Unit

Collector Emitter Voltage

900

V_ces

I_C1

Continuous Collector Current @ T_C= 25°C

Continuous Collector Current @ T_C= 100°C

Pulsed Collector Current ¹

I_C2

I_CM

V_GE

Gate-Emitter Voltage ²

±30

P_D

Total Power Dissipation @ T_C= 25°C

Switching Safe Operating Area @ T_J= 150°C

Operating and Storage Junction Temperature Range

223

SSOA

T_J, T_STG

T_L

79A @ 900V

-55 to 150

°C

Lead Temperature for Soldering: 0.063" from Case for 10 Seconds

300

Static Characteristics

Symbol Parameter

T = 25°C unless otherwise speciﬁed

Test Conditions

Min

Typ

Max

Unit

V_BR(CES)

Collector-Emitter Breakdown Voltage

V_GE= 0V, I_C= 1.0mA

900

T_J= 25°C

T_J= 125°C

2.5

2.2

4.5

3.1

V_GE= 15V,

I_C= 14A

V_CE(on)

V_GE(th)

I_CES

Collector-Emitter On Voltage

Gate Emitter Threshold Voltage

Zero Gate Voltage Collector Current

Gate-Emitter Leakage Current

V_GE=V_CE, I_C= 1mA

T_J= 25°C

350

V_CE= 900V,

V_GE= 0V

μA

T_J= 125°C

1500

±100

I_GES

V_GS= ±30V

Microsemi Website - http://www.microsemi.com

12 3 4 5 6 7...9

中文翻译

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