Series APF Low Height Thin-Fin
Forged Heat Sinks
TechnicalData
Features
•
Precision Forging Technology for
High Power Applications
•
•
Low Profile Thin Fins
Designed for BGA and Other Surface
Mount Packages
•
•
Select from Multiple Fin Heights
Improved Thermal Performance
Over Conventional Heat Sinks
Product Benefits
•
•
No Special Tools Needed for Assembly
No Additional Holes Required On the
PCB
•
Adhesive Tape Mounting Convenience
Series APF Low Height Thin Fin Forged Heat Sink
Pressure Drop
Fin Matrix
(Rows x Columns)
12 X 2
Length x Width x Height
Thermal Resistance
(°C/Watt @ 200 LFPM)
(Inches of
Water)
.033
Part Number
(mm)
APF19-19-06CB
APF19-19-10CB
APF19-19-13CB
APF30-30-06CB
APF30-30-10CB
APF30-30-13CB
APF40-40-06CB
APF40-40-10CB
APF40-40-13CB
19 x 19 x 6.3
19 x 19 x 9.5
19 x 19 x 12.7
30 x 30 x 6.3
30 x 30 x 9.5
30 x 30 x 12.7
40 x 40 x 6.3
40 x 40 x 9.5
40 x 40 x 12.7
7.05
5.25
3.95
4.35
3.25
2.45
3.30
2.50
1.90
12 X 2
12 X 2
19 x 3
19 x 3
19 x 3
26 x 4
26 x 4
26 x 4
.033
.033
.039
.039
.039
.043
.043
.043
TAPE STYLES
Material: Nylon Plastic per UL94-V0
Thermal
Tape
Thickness Thermal Impedance
Dielectric
Strength (V/mil)
Supplier
IERC
Description
(mm)
(°C-in²/W)
Double-sided acrylic adhesive on a Kapton MT
carrier.
Double-sided acrylic adhesive loaded
A01
0.13
0.82
4,000
N/A
T410 Chomerics
T411 Chomerics
0.18
0.28
1.10
1.00
w/aluminum oxide on an aluminum foil carrier.
Double-sided silicone adhesive with expanded
aluminum mesh carrier.
N/A
Double-sided acrylic adhesive loaded w/
titanium diboride on an expanded aluminum
carrier.
T412 Chomerics
0.23
0.25
N/A
Page 1 of 2
October 2006
IERC a CTS Company
413 North Moss Street
Burbank, CA 91502
818-842-7277
www.ctscorp.com